The Small Angle Cleavage Technique: An Update

Scott D. Walck; John P. McCaffrey

doi:10.1557/PROC-480-149

Abstract

The Small Angle Cleavage Technique is a relatively simple and inexpensive method of producing superior cross sectional TEM specimens. For speed of preparation, it is unsurpassed. One limitation is that the technique does require the substrate material to cleave or fracture. For this reason, it has been applied almost exclusively to semiconductor materials. Recently, the technique has been extended to other substrates such as glass, silicon carbide, quartz, sapphire, and other hard materials. It is particularly well suited for rapidly examining coatings and thin films very soon after they are deposited. Several procedures have been added or modified to the original technique developed by McCaffrey to simplify the technique. The steps are presented in a detailed pictorial outline form. A method for mounting the cleaved samples utilizing a commercially available grid is presented. In addition, the advantages that the special geometry of the prepared samples have when mounted properly in a double-tilt holder are discussed with respect to the angular range of tilting experiments that are now possible in the TEM.

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The Small Angle Cleavage Technique: An Update

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This article has been cited by the following publications. This list is generated based on data provided by Crossref.

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The Small Angle Cleavage Technique: An Update

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