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Strain Engineering and Luminescence in Si/SiGe Three Dimensional Nanostructures

Published online by Cambridge University Press:  25 May 2011

Nikhil Modi
Affiliation:
Department of Electrical and Computer Engineering, New Jersey Institute of Technology, 106 Warren St, Newark, NJ 07102, U.S.A.
Leonid Tsybeskov
Affiliation:
Department of Electrical and Computer Engineering, New Jersey Institute of Technology, 106 Warren St, Newark, NJ 07102, U.S.A.
David J. Lockwood
Affiliation:
Institute for Microstructural Sciences, National Research Council, Ottawa, ON, Canada
Xiao Z. Wu
Affiliation:
Institute for Microstructural Sciences, National Research Council, Ottawa, ON, Canada
Jean Marc Baribeau
Affiliation:
Institute for Microstructural Sciences, National Research Council, Ottawa, ON, Canada
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Abstract

Strain engineering in composition-controlled Si-Si/Ge nanocluster multilayers with high germanium content (~ 50%) is achieved by varying thicknesses of Si/SiGe layers and studied by low temperature photoluminescence (PL) measurements. The PL spectra show reduction in strained silicon energy bandgap and a splitting presumably associated with partial removal of heavy hole-light hole degeneracy in SiGe valence band. Time-resolved PL measurements performed under different excitation wavelengths show dramatically different PL lifetimes, ranging from ~ 2 μs to 10 ns and an unusually high PL quantum efficiency. The results are explained by using the Si/SiGe interface recombination model, which is supported by ultra-high resolution transmission and analytical electron microscopy measurements.

Type
Research Article
Copyright
Copyright © Materials Research Society 2011

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References

REFERENCES

1. Baribeau, J.-M., Jackman, T. E., Houghton, D.C., Maigńe, P., Denhoff, M.W., J. Appl. Phys., 63, 5738 (1988)Google Scholar
2. Lockwood, D.J., Baribeau, J.-M., Kamanev, B.V., Lee, E.-K., Tsybeskov, L., Semicond. Sci. Tech., 23, 064003 (2008)Google Scholar
3. Thewalt, M.L.W., Harrison, D.A., Reinhart, C.F., Wolk, J.A., Phys. Rev. Lett., 79, 269 (1997)Google Scholar
4. Baier, T., Mantz, U., Thonke, K., Sauer, R., Schaffler, F., Herzog, H.-J., Phys. Rev. B, 50, 15191 (1994)Google Scholar
5. Brunner, K., Rep. Prog. Phys., 65, 27 (2002)Google Scholar
6. Richard, S., Aniel, F., Fishman, G., Cavassilas, N., J. Appl. Phys., 94, 1795 (2003)Google Scholar
7. Van de Walle, C.G., Martin, R.M., Phys. Rev. B, 34, 5621 (1986)Google Scholar
8. Munguia, J., Bremond, G., Bluet, J.M., Hartmann, J.M., Mermoux, M., Appl. Phys. Lett., 93, 102101 (2008)Google Scholar
9. Euaruksakul, C., Li, Z.W., Zheng, F., Himpsel, F.J., Ritz, C.S., Tanto, B., Savage, D.E., Liu, X.S., Lagally, M.G., Phys. Rev. Lett., 101, 147403 (2008)Google Scholar
10. Takagi, S-i., Hoyt, J.L., Welser, J.J., Gibbons, J.F., J. Appl. Phys., 80, 1567 (1996)Google Scholar
11. Tsybeskov, L., Lockwood, D.J., Proc. IEEE, 97, 1284 (2009)Google Scholar