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Strength of Multicrystalline Silicon Wafers for Various Surface Conditions

Published online by Cambridge University Press:  31 January 2011

Przemyslaw Rupnowski ,
Bhushan Sopori ,
Dan Armentrout  and
Ethan Good
Przemyslaw Rupnowski
Affiliation:
peter.rupnowski@nrel.gov, National Renewable Energy Laboratory, 1617 Cole Blvd., Golden, Colorado, 80401, United States
Bhushan Sopori
Affiliation:
Bhushan.Sopori@scholarone.net, National Renewable Energy Laboratory, Golden, Colorado, United States
Dan Armentrout
Affiliation:
darmentr@du.edu, Univeristy of Denver, Department of Mechanical and Materials Engineering, Denver, Colorado, United States
Ethan Good
Affiliation:
ethan.good@solarworldusa.com, Solar World, Hillsboro, Oregon, United States
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Abstract

This study focuses on fracture properties of silicon wafers used by the photovoltaic (PV) industry as substrates for solar cells. In the first part, we numerically model three fixtures that are often used to test the strength of PV wafers. In the second part, we employ our previously developed model to predict strength of the wafers as a function of loading fixture and surface treatment. Surface treatment is simulated by removing damage from the wafer surface.

Keywords

Sifracturestrength
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1210: Symposium Q – Photovoltaic Materials and Manufacturing Issues II , 2009 , 1210-Q05-07
Copyright
Copyright © Materials Research Society 2010

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References

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