Hostname: page-component-cd9895bd7-fscjk Total loading time: 0 Render date: 2024-12-29T11:16:57.565Z Has data issue: false hasContentIssue false
  • English
  • Français

Stress Evolution During Crystallization and Isothermal Annealing of Titanium-Nickel on (100) Si

Published online by Cambridge University Press:  10 February 2011

Jinping Zhang  and
D. S. Grammon
Jinping Zhang
Affiliation:
Department of Materials Science and Mechanics, Michigan State University, East Lansing, MI 48824
D. S. Grammon
Affiliation:
Department of Materials Science and Mechanics, Michigan State University, East Lansing, MI 48824
Get access

Abstract

Thin films of near-equiatomic titanium-nickel are capable of thermally induced shape-strains and have recently been applied to silicon-based micromachined reversible actuators in force-production devices requiring energy-density levels substantially exceeding those available from piezoelectric, electromagnetic, electrostatic, or bimetal systems. Reversible actuation requires the presence of a resetting agent, or ‘bias’ force, capable of deforming the martensite phase during the exothermic transformation on cooling. Here, we show that both the initial martensite ‘programming’ force, and the bias force for subsequent reversible actuation, can readily be provided by manipulating intrinsic and extrinsic stresses developed during low-pressure sputter deposition of TiNi, and subsequent cooldown from either the deposition process temperature or from the crystallization annealing temperature. The stability of both intrinsic and extrinsic stresses at temperatures below the deposition temperature allows considerable flexibility in the design of the force-producing system, and reversible stress-production to levels beyond 0.7 GPa are shown to be readily achieved, corresponding to energy-density levels approaching 10 MJ-m−2. The present paper will review recent results from our group on the development of residual stresses in TiNi sputtered on (100) Si, using the wafer-curvature method applied during isochronal and isothermal vacuum annealing of both amorphous and crystalline thin films, with an emphasis on the combined influence of deposition temperature and annealing temperature on stress-relaxation rates, and on the response of the system to temperature cycling in the displacive transformation range.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 459: Symposium Y – Materials for Smart Systems II , 1996 , 451
Copyright
Copyright © Materials Research Society 1997

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

[1] Keely, A., Stockel, D. and Duerig, T. W. in Engineering Aspects of Shape Memory Alloys, Duerig, T. W., Melton, K. N., Stockel, D. and Wayman, C. M., Eds, Butterworth-Heinemann, p 181 (1990).Google Scholar
[2] Otsuka, K. and Shimizu, K. (1986), Int. Met. Rev. 1986 31, 93.Google Scholar
[3] Busch, J.D., Johnson, A.D., Hodgson, D.E., Lee, C.H., Stevenson, D.A., Proc Int'l. Conf. on Martensitic Trans. (ICOMAT-89) (1989).Google Scholar
[4] Busch, J.D. and Johnson, A.D., J. Appl. Phys. 68 (12), 6224–6228 (1990).Google Scholar
[5] Grummon, D. S., Hou, Li, Zhao, Z. and Pence, T. J., J. de Physique IV, Colloque C8 665–670 (1995).Google Scholar
[6] Hou, Li and Grummon, D. S., Scripta Metallurgica 33, 989–995 (1995).Google Scholar
[7] Miyazaki, S., Hashinaga, T., Yumikura, K., Horikawa, H., Ueki, T. and Ishida, A., Proc. 1995 North American Conf. On Smart Structures and Materials, (1995).Google Scholar
[8] Hou, Li, Pence, T. J. and Grummon, D. S., Mat. Res. Soc. Proc. 360, pp 369–374 (1995).Google Scholar
[9] Walker, J. A. and Gabriel, J., Proc. 5th Int. Conf. on Solid State Sensors and Actuators (ext. abstr. B8), June 1989, Montreaux, Switzerland, 123 (1989).Google Scholar
[10] Minemura, T., Andoh, H., Nagai, M., Watanabe, R., Shimizu, S. and Ikuta, I. (1987), J. Mal. Sci. Lelt. 6.Google Scholar
[11] Johnson, A.D., J. Micromech. Microeng. 1, 34–41 (1991).Google Scholar
[12] Chang, L., Ph.D. Thesis, Michigan State University, 1994 Google Scholar
[13] ASM Metals Handbook, 10th ed., Vol 2, p 899; The Materials Information Society (1990).Google Scholar
[14] Zhao, Z., M.S. Thesis, Michigan State University (1995).Google Scholar
[15] Handbook of Thermophysical Properties of Solid Materials, Goldsmith, A., Waterman, T. and Hirschorn, H., Armor Research Foundation, Pergamon (1961).Google Scholar
[16] Hoffmann, D. W. and Thornton, J. A., J. Vac. Sci. and Tech. 20, p 335 (1982).Google Scholar
[17] Lee, A. P., Ciarlo, D. R., Krulevitch, P. A., Lehew, S., Trevino, J. and Northrap, M. A., Proc. 8th Int. Conf on Sol. State Sensors and Actuators, and Eurosensors IX, Stockholm, June 1995, pp 368–371 (1995).Google Scholar