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Structure and Mechanical Properties of Titanium Nitride, Zirconium Nitride, and Chromium Nitride Films by Reactive Magnetron-Sputter Deposition

Published online by Cambridge University Press:  10 February 2011

W.-H. Soe ,
T. Kitagaki ,
H. Ueda ,
N. Shima ,
M. Otsuka  and
R. Yamamoto
W.-H. Soe
Affiliation:
Institute of Industrial Science, University of Tokyo, 7–22–1 Roppongi, Minato-ku, Tokyo 106, Japan, soe@iis.u-tokyo.ac.jp
T. Kitagaki
Affiliation:
Shibaura Institute of Technology, 3–9–14 Shibaura, Minato-ku, Tokyo 106, Japan
H. Ueda
Affiliation:
Hitachi Tool Engineering, Ltd., 13–2 Shinizumi, Narita-shi, Chiba 286, Japan
N. Shima
Affiliation:
Hitachi Tool Engineering, Ltd., 13–2 Shinizumi, Narita-shi, Chiba 286, Japan
M. Otsuka
Affiliation:
Shibaura Institute of Technology, 3–9–14 Shibaura, Minato-ku, Tokyo 106, Japan
R. Yamamoto
Affiliation:
Institute of Industrial Science, University of Tokyo, 7–22–1 Roppongi, Minato-ku, Tokyo 106, Japan, soe@iis.u-tokyo.ac.jp
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Abstract

TiN, ZrN, and CrN films were grown by reactive magnetron sputtering on WC-Co sintered hard alloy substrates. Hardness and elastic modulus were measured by nano-indentation tester with low load on tip at 200 mgf. Hardness values were shown the higher value the thinner film thickness due to stress in the films.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 458: Symposium W – Interfacial Engineering for Optimized Properties , 1996 , 379
Copyright
Copyright © Materials Research Society 1997

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References

REFERENCES

1. Buhl, R., Pulker, K., and Moll, E., Thin Solid Films 80, p.265 (1981).Google Scholar
2. Nakamura, K., Inagawa, K., Tsuruoka, K., and Komiya, S., Thin Solid Films 40, p. 155 (1977).Google Scholar
3. Hatschek, R. L., Am. Mach. Speical Report No. 752, p. 129 March (1983).Google Scholar
4. Poitevin, J. M., Lemperiere, G., and Tardy, J., Thin Solid Films 97, p. 69 (1982).Google Scholar
5. Sundgren, J.-E., Johnasson, B. O., and Karlsson, S.-E., Thin Solid Films 105, p. 353 (1983).Google Scholar
6. Fleischer, W., Schulze, D., Wilberg, R., Lunk, A., and Schiade, F., Thin Solid Films 63, p. 347 (1979).Google Scholar
7. Jacobson, B. E., Nimmagadda, R., and Bunshah, R. F., Thin Solid Films 63, p. 333 (1979).Google Scholar
8. Petersson, J. R., J. Vac. Sci. Technol. 11, p.715 (1974).Google Scholar
9. Chevallier, J., Chabert, J. P., and Spitz, J., Thin Solid Films 80, p.263 (1981).Google Scholar
10. Doener, M. F., and Nix, W. D., J. Mater. Res. 1, p. 601 (1986).Google Scholar
11. Yang, W. M. C., Tsakalakos, T., and Hilliard, J. E., J. Appl. Phys. 48, p.876 (1977).Google Scholar