Published online by Cambridge University Press: 15 February 2011
Transmission electron microscopy (plan-view as well as cross-section) and high-resolution Rutherford backscattering and channeling techniques have been combined to investigate residual defects and substitutional concentrations of In and Sb in <100> and <111> orientations of ion implanted silicon layers after solid-phase-epitaxial (SPE) growth at 475–600°C. The maximum concentrations of Sb and In in substitutional sites were found to be, respectively, 1.3 × 1021 and 5.0 × 1019 cm−3 , exceeding the respective retrograde maxima by factors of 18 and 60. These results provide direct evidence of solute trapping and metastable alloying under solid-phase growth conditions. Accumulation of solute at the crystalline-amorphous interface was observed only for indium above a certain interfacial concentration. At still higher interfacial concentrations, the planar interface was observed to become unstable and SPE growth was retarded.
Research sponsored by the Division of Materials Sciences, U. S. Department of Energy under contract W-7405-eng-26 with Union Carbide Corporation.