Hostname: page-component-cd9895bd7-gxg78 Total loading time: 0 Render date: 2024-12-28T03:59:13.730Z Has data issue: false hasContentIssue false

Study of the Interface/Bonding of Boron Nitride (BN) Nanocomposites

Published online by Cambridge University Press:  16 March 2015

Angel L. Morales-Cruz
Affiliation:
University of Puerto Rico, PO Box 30770 San Juan,PR 00931, U.S.A.
Janet Hurst
Affiliation:
NASA Glenn Research Center, 21000 Brookpark Rd, Cleveland, OH 44135, U.S.A.
Diana Santiago
Affiliation:
NASA Glenn Research Center, 21000 Brookpark Rd, Cleveland, OH 44135, U.S.A.
Get access

Abstract

Boron nitride nanotubes (BNNTs), an analogue of carbon nanotube (CNT) is one of the most used non-metallic materials in high technology applications related to thin film fabrications. Taking advantage of their unique properties such as electrically non-conductive, thermally conductive, and high hardness, it has been used in high-temperature electronic devices, multifunctional aerospace materials, and structures and electric and aerospace systems. The main goal of this project was to use BNNTs in the fabrication of nano epoxycomposites to enhance their thermal and mechanical properties to use it for applications in aerospace constituents. In order to accomplish this goal, BNNTs were functionalized with isopherone diisocyante (IPDC). Surface analysis techniques were employed to ensure the modification BNNTs and study the interface of the reinforced composites before and after the modification. Mechanical and thermal conductivity testing was performed in order to understand the quality of the composites. Three different nanocomposites were accomplished with hBN and BNNTs using two different epoxy polymers and three curing agents. The systems EPON 862/Curing Agent W/ (hBN or BNNTs) have Tgs and tan deltas higher compared with those fabricated at the same conditions without nanoparticles. The fabricated BN composites showed improved physical properties due to their particle dispersion and boron nitrite intermolecular interactions with the epoxy polymer.

Type
Articles
Copyright
Copyright © Materials Research Society 2015 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

Chen, S., Wang, D. Z., Huang, J. Y., Ren, Z. F., Appl. Phys. A79, 1757 (2004).CrossRefGoogle Scholar
Kahaly, M. U., Waghmare, U. V., J. of Nanoscience and Nanotechnology 8, 4041 (2008).CrossRefGoogle Scholar
Wang, C. X., Yang, G. W., Zhang, T. C., Liu, H. W., Han, Y. H., Luo, J. F., Gao, C. X., Zou, G. T., Diamond and Related Materials 12, 14221425 (2003).CrossRefGoogle Scholar
Liao, K. J., Wang, W. L., Kong, C. Y., Surface and Coatings 141, 216219 (2001).CrossRefGoogle Scholar
Taniguchi, T., Tanaka, J., Mishima, D., Ohsawa, T., Yamaoka, S., App. Phys. Lett. 62, 576 (1993).CrossRefGoogle Scholar
Zhou, S. J., Ma, C. Y., Meng, Y. Y., Su, H. F., Zhu, Z., Deng, S. L., Xie, S. Y., Nanotechnology 23, 55708 (2012).CrossRefGoogle Scholar
Moniruzzaman, M., Winey, K. I., Macromolecules, 39, 51945205 (2006).CrossRefGoogle Scholar
IIjima, S., Nature 354, 5658 (1991).CrossRefGoogle Scholar
Chen, C., Khobaib, M., Curliss, D., Progress in Organic Coatings, 47, 376383 (2003).CrossRefGoogle Scholar