Hostname: page-component-cd9895bd7-mkpzs Total loading time: 0 Render date: 2024-12-30T22:14:10.455Z Has data issue: false hasContentIssue false

Study the Conduction Mechanism and the Electrical Response of Strained Nano-thin 3C-SiC Films on Si used as Surface Sensors

Published online by Cambridge University Press:  01 February 2011

Ronak Rahimi
Affiliation:
rrahimi@mix.wvu.edu, West Virginia University, Lane Department of Computer Science and Electrical Engineering, MOrgantown, West Virginia, United States
Christopher M Miller
Affiliation:
c4miller4@gmail.com, West Virginia University, Lane Department of Computer Science and Electrical Engineering, MOrgantown, West Virginia, United States
Alan Munger
Affiliation:
MUNGERAJ1@GCC.EDU, West Virginia University, Department of Mechanical and Aerospace Engineering, Morgantown, West Virginia, United States
Srikanth Raghavan
Affiliation:
rrahimi@mix.wvu.edu, West Virginia University, Lane Department of Computer Science and Electrical Engineering, MOrgantown, West Virginia, United States
C D Stinespring
Affiliation:
rrahimi@mix.wvu.edu, West Virginia University, Lane Department of Computer Science and Electrical Engineering, MOrgantown, West Virginia, United States
D Korakakis
Affiliation:
rrahimi@mix.wvu.edu, West Virginia University, Lane Department of Computer Science and Electrical Engineering, MOrgantown, West Virginia, United States
Get access

Abstract

Various superior properties of SiC such as high thermal conductivity, chemical and thermal stability and mechanical robustness provide the basis for electronic and MEMS devices of novel design [1]. This work evaluates heterostructures that consist of a few nanometers-thick 3C-SiC films on silicon substrates. Nano-thin SiC films differ significantly in their electrical behavior compared to the bulk material [2], a finding that gives rise to a potential use of these films as surface sensors. To gain a better understanding of the effect of surface states on the electrical response of these thin, strained films, several metal-semiconductor-metal heterostructures have been examined under variable conditions. The nano-thin, strained films were grown using gas source molecular beam epitaxy. Reflection high-energy electron diffraction patterns obtained from several 3C-SiC films indicate that these films are strained nearly 3% relative to the SiC lattice constant. Al, Cr and Pt contacts to a nano-thin film 3C-SiC were deposited and characterized. I-V measurements of the strained nano-thin films demonstrate metal-semiconductor-metal characteristics. Band offsets due to biaxial tensile strain introduced within the 3C-SiC films were calculated and band diagrams incorporating strain effects were simulated. Electron affinity of 3C-SiC has been extracted from experimental I-V curves and is in good agreement with the value that has been calculated for a strained 3C-SiC film [3]. On the basis of experimental and simulation results, an empirical model for the current transport has been proposed. Fabricated devices have been characterized in a controlled environment under hydrogen flow and also in a reactive ambient, while heating the sample and oxidizing the surface, to investigate the effects of the environment on the surface states. Observed changes in I-V characteristics suggest that these nano-thin films can be used as surface sensors.

Type
Research Article
Copyright
Copyright © Materials Research Society 2009

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Azevedo, R.G., Jones, D.G., Jog, A.V., Jamshidi, B., Myers, D.R., Chen, L., Fu, X., Mehregany, M., Wijesundara, M.B., Pisano, A.P., IEEE Sens. J. 7, 801803 (2007).Google Scholar
2. Hsieh, W.T., Fang, Y.K., Wu, K.H., Lee, W.J., Ho, J.J. and Ho, C.W., IEEE Trans. Electron Devices 48, 8012803 (2001)Google Scholar
3. Choyke, W.J., Feng, Z.C. and Powell, J.A., Jour. of Appl. Phys 64, 3163 (1988).Google Scholar
4. Matthews, J.W. and Blakeslee, A.E., Jour. of Crys. Growth 27, 118 (1974).Google Scholar
5. Ohler, C., Daniels, C., Forster, A. and Luth, H., Phy. Rev.B 58, 7864 (1998).Google Scholar
6. Feng, Z.C., Mascarenhas, A., Choyke, W.J. and Powell, J.A., J. Appli. Phys. 64, 3176 (1988).Google Scholar
7. Mukaida, H., Okumura, H., Lee, J.H., Daimon, H., Sakuma, E., Endo, K. and Yoshida, S., J. Appl. Phys. 62, 254 (1987).Google Scholar
8. Ziemer, K. S., Woodworth, A.A., Peng, C.Y. and Stinespring, C.D., Diamond and Related Mat. 16, 486 (2007).Google Scholar
9. Rahimi, R., Raghavan, S., Shelton, N.P., Penigalapatil, D., Balling, A., Woodworth, A.A., Denig, T., Stinespring, C.D. and Korakakis, D., Mater. Res. Soc. Symp. Proc. 1056, (2008).Google Scholar
10. Davis, R.F., Kelner, G., Shur, M., Palmour, J.W., Edmond, J.A., Proc. of the IEEE 79, 677701 (1991).Google Scholar
11. Zhang, Z.Y., Jin, C.H., Liang, X.L., Chen, Q. and Peng, L.M., Appl. Phys. Lett. 88, 73102 (2006).Google Scholar
12. Sze, S.M, “Metal-Semiconductor Contacts” Physics of Semiconductor Devices New York: John Wiley & Sons, (1981).Google Scholar
13. Kuo, C.P., Vong, S.K., Cohen, R.M. and Stringfellow, G.B., J. Appli. Phys. 57, 5428 (1985).Google Scholar
14. Foresi, J.S. and Moustakas, T.D., Applied Physics Letters 62, 2859–61 (1993).Google Scholar