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Tensile Strength and Creep Resistance in Nanocrystalline Cu, Pd and Ag
Published online by Cambridge University Press: 28 February 2011
Abstract
Measurements of tensile strength and creep resistance have been made on bulk samples of nanocrystalline Cu, Pd and Ag consolidated from powders by cold compaction. Samples of Cu-Cu2O have also been tested. Yield strength for samples with mean grain sizes of 5–80 nm and bulk densities on the order of 95% of theoretical density are increased 2–5 times over that measured in pure, annealed samples of the same composition with micrometer grain sizes. Ductility in the nanocrystalline Cu has exceeded 6% true strain, however, nanocrystalline Pd samples were much less ductile. Constant load creep tests performed at room temperature at stresses of >100 MPa indicate logarithmic creep. The mechanical properties results are interpreted to be due to grain size-related strengthening and processing flaw-related weakening.
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- Copyright © Materials Research Society 1991
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