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Thermal and Mass Balance in Reactive Thermal Processing of Nickel Aluminide Coatings on Steel Substrates

Published online by Cambridge University Press:  11 February 2011

Tarek Alaeddine ,
Rajesh Ranganathan ,
Teiichi Ando ,
Charalabos C. Doumanidis  and
Peter Y. Wong
Tarek Alaeddine
Affiliation:
Mechanical Engineering Department, Tufts University, Medford, MA 02155.
Rajesh Ranganathan
Affiliation:
Dept. of Mechanical Industrial and Manufacturing Engineering, Northeastern University, Boston, MA 02115.
Teiichi Ando
Affiliation:
Dept. of Mechanical Industrial and Manufacturing Engineering, Northeastern University, Boston, MA 02115.
Charalabos C. Doumanidis
Affiliation:
Mechanical Engineering Department, Tufts University, Medford, MA 02155.
Peter Y. Wong
Affiliation:
Mechanical Engineering Department, Tufts University, Medford, MA 02155.
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Abstract

Nickel aluminide coatings were produced on steel substrates by reactive thermal processing of pre-plated precursor layers of nickel and aluminum using plasma arc as the heat source. Controlled rapid heating melted the outer aluminum layer, which then dissolved nickel to facilitate the nucleation and growth of a nickel aluminide. The resultant coating microstructures varied from a duplex or triplex structure, consisting of either NiAl3 and a eutectic; Ni2Al3, NiAl3 and a eutectic; to a fully monolithic Ni2Al3 structure, with the latter resulting at high heat input rates and/or low heat-source traverse rates. The temperature of the reaction layer was simulated for the experimental conditions by a numerical model based on Green's function analysis. The nickel concentration at the liquid-solid interface just before any nickel aluminide nucleation was calculated by assuming local equilibrium interface conditions between the liquid layer and the fcc nickel-rich solution. The depth of nickel dissolution, which consequently determines the extent of nickel aluminide growth, was also predicted by the model. Numerical results of the nickel dissolution compared well with experimental observations.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 750: Symposium Y – Surface Engineering 2002–Synthesis, Characterization and Applications , 2002 , Y5.27
Copyright
Copyright © Materials Research Society 2003

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References

REFERENCES

1. Chen, H.C. and Pfender, E., Thin Solid Films, 280, pp. 188–198, (1996).Google Scholar
2. Ng, H. P., Meng, X. K. and Ngan, A. H. W., Scripta Materialia, 39, p. 1737–1742, (1998).Google Scholar
3. Sugama, T., Journal of Material Science, 33, pp. 3791–3803, (1998).Google Scholar
4. ASM Handbook, “Friction, Lubrication and Wear Technology“, 18, pp.832–833, (1990).Google Scholar
5. Chen, H.C. and Pfender, E., Thin Solid Films, 280, p. 188–198, (1996).Google Scholar
6. Goward, G. W., Boone, D. H., Giggins, C. S., ASM Trans., 60, pp.228–241, (1967).Google Scholar
7. Tzafestas, S.G. (editor), “DistributedParameter Control Systems“, (Pergamon Press, Oxford, UK, 1982).Google Scholar
8. Ray, W.H., Lainiotis, D.G., “DistributedParameter Systems: Identification, Estimation, and Control“, (Marcel Dekker, New York, NY, 1978).Google Scholar
9. Carslaw, H.S., Jaeger, J.C., “Conduction of Heat in Solids“, Second Edition, (Oxford, Clarendon Press, 1959).Google Scholar
10. Beck, J.V., Cole, K.D., Haji-Sheikh, A., Litkouhi, B., “Heat Conduction Using Green's Functions“, (Hemisphere Publishing Corporation, 1992).Google Scholar
11. Ranganathan, R., “Fabrication of Intermetallic and Composite Coatings from Precursors“, (Masters Thesis, Northeastern University, Boston, MA, 2001).Google Scholar
12. Fromberg, W., Sandy Donaldson, F.A., Adv. Mater. Processes, 1996, vol. 2, pp. 33–35.Google Scholar