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Published online by Cambridge University Press: 17 March 2011
State-of-the-art ICs for microprocessors routinely dissipate power densitieson the order of 50 W/cm2. This large power is due to thelocalized heating of ICs operating at high frequencies, and must be managedfor future high-frequency microelectronic applications. Our approachinvolves finding new and efficient thermally conductive materials.Exploiting carbon nanotube (CNT) films and composites for their superioraxial thermal conductance properties has the potential for such anapplication requiring efficient heat transfer. In this work, we presentthermal contact resistance measurement results for CNT and CNT-Cu compositefilms. It is shown that Cu-filled CNT arrays enhance thermal conductancewhen compared to as-grown CNT arrays. Furthermore, the CNT-Cu compositematerial provides a mechanically robust alternative to current IC packagingtechnology.