Hostname: page-component-78c5997874-ndw9j Total loading time: 0 Render date: 2024-11-11T03:35:45.884Z Has data issue: false hasContentIssue false

Thermoelectric Nanowires by Electrochemical Deposition

Published online by Cambridge University Press:  21 March 2011

Oded Rabin
Affiliation:
Dept. of Chemistry. Massachusetts Institute of Technology, Cambridge, MA 02139, U.S.A
Yu-Ming Lin
Affiliation:
Dept. of Chemistry. Massachusetts Institute of Technology, Cambridge, MA 02139, U.S.A
Stephen B. Cronin
Affiliation:
Dept. of Physics. Massachusetts Institute of Technology, Cambridge, MA 02139, U.S.A
Mildred S. Dresselhaus
Affiliation:
Dept. of Electrical Engineering and Computer Science. Massachusetts Institute of Technology, Cambridge, MA 02139, U.S.A Dept. of Physics. Massachusetts Institute of Technology, Cambridge, MA 02139, U.S.A
Get access

Abstract

Nanowires made of thermoelectric-relevant materials were grown by electrochemical deposition. Their diameter and ordering are dictated by the porous alumina template that is fabricated on the working electrode prior to the deposition. The composition of the nanowires is controlled by the composition of the electrolyte and the deposition potential. This technique offers unique opportunities regarding the range of geometries and materials that can be employed. The structural and transport properties of these wires will be presented, and comparison will be made to nanowires synthesized by other techniques.

Type
Research Article
Copyright
Copyright © Materials Research Society 2002

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. DiSalvo, F.J., Science 285, 703 (1999).Google Scholar
2. Dresselhaus, M.S. et al. , in Recent Trends in Thermoelectric Materials Research III, edited by Tritt, T.M. (Academic Press, San Diego, 2001), p. 1.Google Scholar
3. Venkatasubramanian, R. et al. , Nature 413, 597 (2001).Google Scholar
4. Harman, T.C. et al. , Proc. 18th Int. Conf. On Thermoelectrics 280 (1999)Google Scholar
5. Routkevitch, D., Tager, A.A., Haruyama, J., Almawlawi, D., Moskovits, M., Xu, J.M., IEEE Trans. Elect. Devices 43, 1646 (1996), and references therein.Google Scholar
6. Martin, C.R., Science 266, 1961 (1994).Google Scholar
7. O'Sullivan, J.P. and Wood, G.C., Proc. Roy. Soc. Lond. A. 317, 511 (1970).Google Scholar
8. Rabin, O. et al. , Mater. Res. Soc. Symp. Proc. 635, D4.7 (2000).Google Scholar
9. Lin, Y.-M. et al. , Mater. Res. Soc. Symp. Proc. 635, C4.30 (2000); Z. Zhang, D. Gekhtman, M.S. Dresselhaus, and J.Y. Ying, Chem. Mater. 11, 1659 (1999).Google Scholar
10. Hong, K. et al. , J. Appl. Phys. 85, 6184 (1999).Google Scholar
11. Liu, K., Chien, C.L., Searson, P.C., Yu-Zhang, K., Appl. Phys. Lett. 73, 1436 (1998).Google Scholar
12. Heremans, J., Thrush, C.M., Lin, Y.-M., Cronin, S., Zhang, Z., Dresselhaus, M.S., Mansfield, J.F., Phys. Rev. B 61, 2921 (2000).Google Scholar