Hostname: page-component-78c5997874-fbnjt Total loading time: 0 Render date: 2024-11-11T05:40:12.120Z Has data issue: false hasContentIssue false
  • English
  • Français

Thermomechanical Characterization of Bismuth Telluride Based Thermoelectric Materials

Published online by Cambridge University Press:  21 March 2011

Witold Brostow ,
Kevin P. Menard  and
John B. White
Witold Brostow
Affiliation:
Laboratory of Advanced Polymers & Optimised Materials (LAPOM), Department of Materials Science, University of North Texas, P.O. Box 305310, Denton, TX 76203-5310
Kevin P. Menard
Affiliation:
PerkinElmer Instruments, 710 Bridgeport Ave, MS F71, Shelton, CT 06484-4796
John B. White
Affiliation:
Marlow Industries, Inc., 10451 Vista Park Road, Dallas, TX 75238-3334
Get access

Abstract

The thermoelectric properties of bismuth telluride based thermoelectric (TE) materials are well-characterized, but comparatively little has been published on the mechanical and thermomechanical properties of these materials. In this paper, we present the initial dynamic mechanical analysis (DMA) data for n-type and p-type bismuth telluride based TE materials. The materials' tan δ values, indicative of viscoelastic energy dissipation modes, approach that of glassy or crystalline polymers and are greater than ten times the tan delta of structural metals. TE samples measured perpendicular to the van der Waals planes have higher tan δ values. Thermal scans in the DMA compressive mode showed changes in mechanical properties versus temperature with clear hysteresis effects. These changes were correlated to differential scanning calorimetry (DSC) thermal transitions. The expected anisotropy was shown in flexural 3-point bending results for one n-type material that showed a storage modulus of 0.10 to 0.45 GPa in the direction parallel to the van der Waals planes and 0.07 to 0.2 GPa in the perpendicular direction.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 691: Symposium G – Thermoelectric Materials 2001--Research and Applications , 2001 , G13.3
Copyright
Copyright © Materials Research Society 2002

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Nolas, G.S., Sharp, J., Goldsmid, H.J., Thermoelectrics Basic Principles and New Materials Developments, 2001, 123–131.Google Scholar
2. Goldsmid, H.J., Electronic Refrigeration, 1986, 89–91.Google Scholar
3. Menard, K.P., Dynamic Mechanical Analysis, 1999.Google Scholar
4. Goldman, A.Y., Viscoelasticity, Creep and Stress Relaxation, Ch. 7 in Performance of Plastics edited by Brostow, W., Hanser, Munich - Cincinnati, 2000.Google Scholar
5. Menard, K.P., Dynamic Mechanical Analysis, 1999, 65.Google Scholar
6. Ferry, J.D., Viscoelastic Properties of Polymers, 1961, 129–131.Google Scholar
7. Ferry, J.D., Viscoelastic Properties of Polymers, 1961, 36.Google Scholar
8. Lakes, R.S., Quackenbush, J., Philosophical Magazine Letters, 74, 1996.Google Scholar
9. Brostow, W., Menard, K.P., White, J.B., Thermomechanical Characterization of Bismuth Telluride Based Thermoelectric Materials – I. DMA Flexural 3-point Bending, NATAS Conference, 2001.Google Scholar
10. Goldsmid, H. J., Electronic Refrigeration, Pion Limited, London, p. 90, 1986. Goldsmid referenced data from Ilisavskii, E. C., 1960, Sov. Phys. Solid State, 3, 2582.Google Scholar
11. Nolas, G.S., Sharp, J., Goldsmid, H.J., Thermoelectrics Basic Principles and New Materials Developments, 2001, 111–112.Google Scholar
12. Asadov, D.A., Kuliev, A.Z. and Mamedov, M.Sh., Mechanical properties and coefficient of thermal expansion of bismuth telluride + bismuth selenide and antimony telluride + bismuth telluride solid solutions [title translated from the Russian], Teplofiz. Svoistva Tverdyh Veshchestv - Mater. Vses. Konf. Teplofiz. Svoistvam Veshchestv Vys. Temp. 1971, 3, C, 14. Text translated from Russian, Fluid Mechanics-Soviet Research, V2, 1973, 109.Google Scholar
13. Brostow, W., Menard, K.P., White, J.B., Thermomechanical Characterization of Bismuth Telluride Based Thermoelectric Materials – III. DMA & DSC Thermal Scans, NATAS Conference, 2001.Google Scholar