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Thermo-Mechanical Reliability of 3D-integrated Microstructures in Stacked Silicon

Published online by Cambridge University Press:  26 February 2011

Bernhard Wunderle ,
R. Mrossko ,
O. Wittler ,
E. Kaulfersch ,
P. Ramm ,
B. Michel  and
H. Reichl
Bernhard Wunderle
Affiliation:
bernd.michel@izm.fhg.de, Fraunhofer IZM, Dept. Micro Materials Center, Gustav-Meyer-Allee 25, Berlin, D-13355, Germany
R. Mrossko
Affiliation:
bernhard.wunderle@izm.fraunhofer.de, AMIC, Berlin, N/A, Germany
O. Wittler
Affiliation:
bernhard.wunderle@izm.fraunhofer.de, Fraunhofer IZM, Dept. Micro Materials Center, Gustav-Meyer-Allee 25, Berlin, D-13355, Germany
E. Kaulfersch
Affiliation:
bernhard.wunderle@izm.fraunhofer.de, AMIC, Berlin, N/A, Germany
P. Ramm
Affiliation:
bernhard.wunderle@izm.fraunhofer.de, Fraunhofer IZM, Dept. Micro Materials Center, Gustav-Meyer-Allee 25, Berlin, D-13355, Germany
B. Michel
Affiliation:
bernhard.wunderle@izm.fraunhofer.de, Fraunhofer IZM, Dept. Micro Materials Center, Gustav-Meyer-Allee 25, Berlin, D-13355, Germany
H. Reichl
Affiliation:
bernhard.wunderle@izm.fraunhofer.de, Technical University Berlin, Berlin, N/A, Germany
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Abstract

This paper investigates the thermo-mechanical reliability of inter-chip-vias (ICV) for 3D chip stacking after processing and under external thermal loads relevant for the envisaged field of application (mobile, automotive) by Finite Element simulation. First the materials are characterised by nano-indentation to determine elasto-plastic data. Finite Element simulations are used to reproduce these data and to extract local material properties like E-modulus and yield stress. Accumulated plastic strain is used as failure indicator under periodic thermal loading of an ICV. Geometrical, material and process-related parameters are varied to obtain first design guidelines for this new technology. The locations of stress and strain accumulation are given.

Keywords

microstructureSisimulation
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 970: Symposium Y – Enabling Technologies for 3-D Integration , 2006 , 0970-Y02-04
Copyright
Copyright © Materials Research Society 2007

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References

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