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Three-DimensionalWafer Process Model for Nanotopography

Published online by Cambridge University Press:  01 February 2011

Takafumi Yoshida
Takafumi Yoshida*
Affiliation:
YNT-jp.Com 2-10-17 Asae, Hikari, Yamaguchi 743-0021, Japan
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Abstract

This paper proposes a three-dimensional wafer process model for nanotopography. This model allows us to predict the effect and behavior of nanotopography on the wafer processes especially for the wafer Mechanical/Chemical Lapping (MLP/CLP), wafer Single/Double Side Polishing (SSP/DSP) and device Chemical Mechanical Polishing (CMP).

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 767: Symposium F – Chemical-Mechanical Planarization , 2003 , F1.1
Copyright
Copyright © Materials Research Society 2003

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References

1. Xu, C. S. et al. , Electrochem. and Sol. State Lett., vol. 1, no. 4, 181 (1998)Google Scholar
2. Yoshida, T. Hayashi, N. Denes, L. Ito, T. Proc. SPIE Symp., Vol.1673, 306 (1992)Google Scholar
3. Lee, Brian et al. , Advanced Semiconductor Manuf. Conf. (2000)Google Scholar
4. Nanz, G. Camilletti, L.E., IEEE Trans. Semiconduct. Manufact., 382 (1995)Google Scholar
5. Yoshida, T. Jpn, Appl. Phys. Fall Meeting, 805 (1998)Google Scholar
6. Yoshida, T. Electrochem. Soc. & Jpn, Appl. Phys. Joint Internl. Meeting, Proc. 3rd Internl. Symp. CMP in IC Device Manufacturing, 593 and 625 (1999)Google Scholar
7. Yoshida, T. Proc. VMIC, 223 (2002)Google Scholar
8. Yoshida, T. Proc. CMP-MIC, 151 (2003)Google Scholar
9. Sneddon, I. N. “Fourier Transforms”, 472, Dover (1951)Google Scholar
10. Feynman, R. P. “The Feynman Lectures On Physics”, II–28, Addison-Wesley (1963)Google Scholar
11. Timoshenko, S. “History of Strength of Materials”, 330, McGraw-Hill (1953)Google Scholar
12. Timoshenko, S. et al. , “Theory of Plates and Shells”, 267, McGraw-Hill (1959)Google Scholar
13. Duddeck, Fabian. M.E., “Fourier BEM”, 88, Springer (2002)Google Scholar
14. Zienkiewicz, O. C. “The Finite Element Method 3rd ed.”, 220, McGraw-Hill (1977)Google Scholar
15. Preston, F. J.Soc.Glass Tech., II, 214 (1927)Google Scholar
16. Glasstone, S. Laidler, K. Eyring, H. “The Theory of Rate Processes”, McGraw-Hill (1941)Google Scholar
17. Bikerman, J.J. “The Science of Adhesive Joints”, 67, Academic Press (1961)Google Scholar