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Ultrafast Deposition of Crystalline Si Films Using a High Density Microwave Plasma

Published online by Cambridge University Press:  01 February 2011

Haijun Jia  and
Michio Kondo
Haijun Jia
Affiliation:
jiahaijunlz@hotmail.com, National Institute of Advanced Industrial Science and Technology, Tsukuba, Japan
Michio Kondo
Affiliation:
m.kondo@aist.jo.jp, National Institute of Advanced Industrial Science and Technology, Research Center for Photovoltaics, Tsukuba, Ibaraki, Japan
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Abstract

A multi-pressure microwave plasma source is developed and is applied for the fast deposition of crystalline silicon films. In this paper, the plasma source is diagnosed firstly. Electron density, electron temperature and discharge gas temperature of the plasmas generated in ambient air are studied using optical emission spectroscopy (OES) method. By using the high density microwave plasma source, depositions of crystalline silicon films from SiH4+He mixture at reduced pressure conditions are investigated systematically. After optimizing the film deposition conditions, highly crystallized Si films are deposited at a rate higher than 700 nm/s. We also find that the deposited films are fully crystallized and crystalline structure of the deposited film evolves along the film growth direction, i.e. large grains in surface region while small grains in the bottom region of the film. Based on the observed results, a possible mechanism, the annealing-assisted plasma-enhanced chemical vapor deposition, is proposed to describe the film growth process.

Keywords

thin filmplasma-enhanced CVD (PECVD) (deposition)Si
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1245: Symposium A – Amorphous and Polycrystalline Thin-Film Silicon Science and Technology-2010 , 2010 , 1245-A10-04
Copyright
Copyright © Materials Research Society 2010

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