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Vapour Deposited Nanocomposite Thin Films

Published online by Cambridge University Press:  25 February 2011

L. S. Wen
L. S. Wen
Affiliation:
Institute of Metal Research, Academia Sinica, Shenyang 110015, China.
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Abstract

Fundamental principles of nanocomposites are discussed. The basic features of nanocomposites are low dimensionality of their composition components, widespreadness of the electronic interactions between the components and the great variety of microstructure of nanocomposites ranging from high level ordered 3-dimensional periodic structure to stochastically dispersed medium of superfine particle. All these offer much more potential for tailoring the property of materials than by formation of chemical compound or mixture including microcomposites. Vapour deposition enhanced by ion beam and electrical discharge plasma provides a class of versatile processes both for preparing low dimensional components of nanocomposites and for synthesizing nanocomposite film itself. Elements of designing nanocomposite thin films and their preparing by ion beam and plasma enhanced vapour deposition are also discussed. Examples of nanocomposite films are given.

Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 181: Symposium B – Advanced Metallizations in Microelectronics , 1990 , 437
Copyright
Copyright © Materials Research Society 1990

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References

REFERENCES

1. Baetzold, R. C., Surface Science, 106, 243.(1981).Google Scholar
2. Yang, W. M. C.. Tsakalakos, T. and Billiard, J. E., J. Appl. Phys., 48. 876 (1977).Google Scholar
3. Henein, G. E. and Hilliard, J. E., J. App1. Phys.. 54, 728 (1983).CrossRefGoogle Scholar
4. Tsakalakos, T. and Hilliard, J. E., J. Appl.Phys., 54, 734 (1983).Google Scholar
5. Baral, D., Ketterson, J. B. and Hilliard, J. E., J. Appl. Phys., 57, 1076 (1985).Google Scholar
6. Todorova, S., Helmersson, U., Barnett, S. A., Sundgren, J. -E., Greene, J. E., IPAT 87, 6th Int. Conf. Ion and Plasma Asisted Techniques, Brighton, UK, May 1987, p248.Google Scholar
7. Wen, L. S., Chen, X. Z., Yang, Q. Q., Zheng, Y. Q., Chuang, Y. Z., 1st Int. Conf. Plasma Surf. Engineering, Sept. 23–27, 1988, Garmisch-Partenkirchen, FRG.Google Scholar
8. Holleck, H. and Schulz, H., Thin Solid Films, 153, 11 (1987).Google Scholar
9. Holleck, H., Metall, 43, 7, 614 (1989).Google Scholar
10. Karch, J.. Birringer, R. & Gleiter, H., Nature. 330, 556 (1987).CrossRefGoogle Scholar
11. Pomerantz, M., Slonczewski, J. C. and Spiller, E., J. Magnetism & Magnetic Materials, 54–57, 781,(1986).Google Scholar
12. Fu, C. L., Freeman, A. J., J. Magnetism & Magnetic Materils, 54–57, 777, (1986).CrossRefGoogle Scholar
13. Spiller, E., in Low Energy X-Ray Diagnostics–1981, eds. Attwood, D. and Henke, B. L., AIP Conf. Proc. №75, AIP, New York, 1981, p.131.Google Scholar
14. Granqvist, C. G., Buhrman, R. A., Wyns, J. and Sievers, A. J., Phys. Rev. Lett., 37, 625 (1976) .Google Scholar