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XPS and Electrochemical Studies on Tungsten-Oxidizer Interaction in Chemical Mechanical Polishing

Published online by Cambridge University Press:  10 February 2011

Dnyanesh Tamboli ,
Sudipta Seal  and
Vimal Desai
Dnyanesh Tamboli
Affiliation:
Advanced Materials Processing & Analysis Center (AMPAC) Mechanical, Materials &Aerospace Engineering Department University of Central Florida Orlando, FL 32816
Sudipta Seal
Affiliation:
Advanced Materials Processing & Analysis Center (AMPAC) Mechanical, Materials &Aerospace Engineering Department University of Central Florida Orlando, FL 32816
Vimal Desai
Affiliation:
Advanced Materials Processing & Analysis Center (AMPAC) Mechanical, Materials &Aerospace Engineering Department University of Central Florida Orlando, FL 32816
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Abstract

Electrochemical interaction between the oxidizer and the metal is believed to play a key role in material removal in tungsten CMP. In this study, we use X-ray Photoelectron Spectroscopy (XPS) in conjunction with electrochemical measurements in both in-situ polishing conditions as well as in static solutions, to identify the passivation and dissolution modes of tungsten. Dissolution of tungsten oxides was found to be the primary non-mechanical tungsten removal mechanism in CMP.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 566: Symposium P – Chemical-Mechanical Poilshing-Fundamentals and Challenges , 1999 , 89
Copyright
Copyright © Materials Research Society 2000

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References

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