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Combined elastic strain and macroscopic stress characterization in polycrystalline Cu thin films

Published online by Cambridge University Press:  01 March 2012

E. Eiper ,
K. J. Martinschitz  and
J. Keckes
E. Eiper
Affiliation:
Erich Schmid Institute for Materials Science, Austrian Academy of Sciences, Institute for Metal Physics, University of Leoben and Materials Centre, Leoben, Austria
K. J. Martinschitz
Affiliation:
Erich Schmid Institute for Materials Science, Austrian Academy of Sciences, Institute for Metal Physics, University of Leoben and Materials Centre, Leoben, Austria
J. Keckes*
Affiliation:
Erich Schmid Institute for Materials Science, Austrian Academy of Sciences, Institute for Metal Physics, University of Leoben and Materials Centre, Leoben, Austria
*
a)a)Author to whom correspondence should be addressed. Electronic mail: keckes@unileoben.ac.at
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Abstract

This work introduces a new simple approach to determine experimental X-ray elastic constants (XECs) of thin films by coupling the sin2ψ method and the substrate curvature technique. The approach is demonstrated on polycrystalline Cu thin films with the thickness 200, 800, and 2400 nm deposited on Si(100) substrates. Applying synchrotron radiation, the elastic strains in the films are determined using sin2ψ method while the macroscopic stresses are assessed by measuring the substrate curvature. The stresses are calculated using the Stoney formula from the radius of substrate curvature determined by the rocking curve measurement of substrate 400 reflection at different sample positions. Results show that the magnitude of the macroscopic stress in the films is proportional to the magnitude of the slope in the sin2ψ plots. On the basis of this observation, XECs of the films were calculated showing no dependence on the film thickness. The characterization of the samples was performed at the synchrotron source Hasylab.

Keywords

X-ray diffractionthermal stressthin filmstoney formulacopper
Type
Technical Articles
Information
Powder Diffraction , Volume 21 , Issue 1 , March 2006 , pp. 25 - 29
Copyright
Copyright © Cambridge University Press 2006

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References

Dehm, G., Inkson, B. J., and Wagner, T. (2002). “Growth and microstructural stability of epitaxial Al films on (0001) alpha-Al2O3 substrates,” Acta Mater. ACMAFD 10.1016/S1359-6454(02)00347-6 50, 5021–5032.CrossRefGoogle Scholar
Dölle, H. (1979). “The influence of the multiaxial stress states, stress gradients and elastic anisotropy on the evaluation of (residual) stresses by X-rays,” J. Appl. Crystallogr. JACGAR 10.1107/S0021889879013169 12, 489–501.CrossRefGoogle Scholar
Keckes, J. (2005). “Simultaneous determination of experimental elastic and thermal strains in thin films,” J. Appl. Crystallogr. JACGAR 38, 311–318.CrossRefGoogle Scholar
Keckes, J., Hafok, M., Eiper, E., Resel, R., and Eisenmenger-Sittner, C. (2004). “Evaluation of experimental stress-strain dependence in thermally cycled Al thin film on Si(100),” Powder Diffr. PODIE2 10.1154/1.1815340 19, 367–371.CrossRefGoogle Scholar
Lau, J. H. (1993). Thermal Stress and Strain in Microelectronic Packaging, ITP, New York.CrossRefGoogle Scholar
Marion, R. H. and Cohen, J. B. (1977). “The need for experimentally determined X-ray elastic constants,” Adv. X-Ray Anal. AXRAAA 20, 355–367.Google Scholar
Nix, W. D. (1989). “Mechanical properties of thin films,” Metall. Trans. A MTTABN 20A, 2217–2245.CrossRefGoogle Scholar
Noyan, I. C. and Cohen, J. B. (1987). Residual Stress: Measurement by Diffraction and Interpretation, Springer, Berlin.CrossRefGoogle Scholar
Noyan, I. C. and Goldsmith, C. C. (1990). “A comparative study of stress determination techniques in polycrystalline thin films,” Adv. X-Ray Anal. AXRAAA 33, 137–144.Google Scholar
Noyan, I. C., Murray, C. E., Chey, J. S., and Goldsmith, C. C. (2004). “Finite size effects in stress analysis of interconnect structures,” Appl. Phys. Lett. APPLAB 10.1063/1.1776331 85, 724–726.CrossRefGoogle Scholar
Pina, J., Dias, A., and Lebrun, J. L. (1999). “Mechanical stiffness of thermally sprayed coatings and elastic constants for stress evaluation by X-ray diffraction,” Mater. Sci. Eng., A MSAPE3 267A, 130–144.CrossRefGoogle Scholar
Rant, S. J., Goldsmith, C. C., and Noyan, I. C. (1994). “Residual stress in thin films of aluminium/hafnium,” Adv. X-Ray Anal. AXRAAA 37, 157–165.Google Scholar
Segmüller, A., Noyan, I. C., and Speriosu, V. S. (1989). “X-ray diffraction studies of thin films and multilayered structures,” Prog. Cryst. Growth Charact. Mater. PCGMED 18, 21–66.CrossRefGoogle Scholar
Stoney, G. G. (1909). “The tension of metallic films deposited by electrolysis,” Proc. R. Soc. London, Ser. A PRLAAZ 82, 172-172.Google Scholar
van Houtte, P. and de Buyser, L. (1993). “The influence of crystallographic texture on diffraction measurements of residual stress,” Acta Mater. ACMAFD 41, 323–336.CrossRefGoogle Scholar
Warren, B. E. (1990). X-ray Diffraction, Dover, New York.Google Scholar
Wern, H., Koch, N., and Maas, T. (2002). “Selfconsistent calculation of the X-ray elastic constants of polycrystalline materials for arbitrary crystal symmetry,” Mater. Sci. Forum MSFOEP 404, 127–132.CrossRefGoogle Scholar