For electronic packaging structure, there are many design parameters that will affect its reliability performance, using experimental way to obtain the reliability result will take a considerable amount of time. Therefore, how to shorten the design time becomes a critical issue for new electronic packaging structure development. This research will combine artificial intelligence (AI) and simulation technology to assess the long-term reliability of wafer level packaging (WLP). A simulation technology using finite element method (FEM) with appropriate mechanics theories has been validated by multiple experiments will replace the experiment to create reliability results for different WLP structures. After a big WLP structure-reliability database created, this study will apply artificial neural network (ANN) theory to analyze this database and obtains a regression model for structure-reliability relationship of WLP. Once the regression model is established and validated, the WLP geometry, such as pad size, die and buffer layer thickness, and solder volume, etc. can be simply entered, and then the WLP reliability results can be immediately obtained through the ANN regression model.

Today's businesses continually search for ways to increase productivity. To achieve this goal, shorter product development cycles and shorter manufacturing times are required. In both cases, problems that may arise during development must be identified much faster. In product development, this is done using virtual prototypes that can be easily duplicated and shared between everyone involved. In addition to this product design process, the stability of the manufacturing process and the resulting product quality ultimately determine the product's profitability. Therefore the manufacturing concepts of a new product can best be demonstrated using Virtual Manufacturing. The subset of Virtual Manufacturing where material properties of the product and machine tools and the physics of the process are investigated is called Virtual Process Engineering. Virtual Process Engineering utilizes Finite Element Methods (FEM) and simulations for the computation of the manufacturing process and Virtual Reality (VR) for quick and intuitive examination of the computation results.