We present results on the growth of Al-Ga-In-N films in multiwafer reactors with 7×2″ wafer capacity. The design of these reactors allows the combination of high efficiency (TMGa efficiency for GaN around 30%) and excellent uniformity. Results on the growth of all materials from the Al-Ga-In-Nitride family are presented in detail. GaN is grown with an excellent optical quality and very good thickness uniformity below 2% across 2″ wafers. The material quality is shown by electron mobility of more than 500 cm2/Vs at an intentional Si-doping of approximately 1×1017 cm−3. Controlled acceptor doping with Mg yields carrier concentrations between 5×1016 and 1018 cm−3. The layer thickness uniformity of the films are better than 2% over a 2″ wafer area. GaInN is grown with PL emission wavelengths in the visible blue region showing a uniformity better than 1.5 nm standard deviation. The film thickness uniformity represents the same figures as obtained for the binary. The compositional uniformity of AlGaN is in the sub 1% range corresponding to a wavelength variation below 1 nm.

The fabrication of heterostructures from these binary and ternary materials is described as well as results from the characterization of these structures. The results show that reliable and efficient production of Al-Ga-In-Nitride based optoelectronic devices can be performed in multiwafer reactors.