As the most abundant engineered material on Earth, concrete is essential to the physical infrastructure of all modern societies. There are no known materials that can replace concrete in terms of cost and availability. There are, however, environmental concerns, including the significant CO2 emissions associated with cement production, which create new incentives for university–industry collaboration to address concrete sustainability. Herein, we examine one aspect of this challenge—the translation of scientific understanding at the microscale into industrial innovation at the macroscale—by seeking improvements in cement-paste processing, performance, and sustainability through control of the mechanisms that govern microstructure development. Specifically, we consider modeling, simulation, and experimental advances in fracture, dissolution, precipitation, and hydration of cement paste precursors, as well as properties of the hardened cement paste within concrete. The aim of such studies is to optimize the chemical reactivity, mechanical performance, and other physical properties of cement paste to enable more sustainable processing routes for this ubiquitous material.

While the global market for photovoltaic (PV) modules continues to grow 30% - 40% annually, manufacturers are looking at advanced technologies and cell concepts in order to improve the cost performance and reliability. One of the challenges faced by the silicon (Si) PV manufacturers is the lack of efficient metal screen-printing technologies. While screen-printing is a long-established technology, THE traditional silver-based pastes have technical limits in terms of paste composition, drying and thermal-firing conditions, line-width, aspect ratio, contact resistance, etc. Such limits keep the industrial cell structure from being close to an ideal PV cell architecture. In an effort to develop alternate printable pastes electrically, electrically conductive adhesives are considered in this study to provide fine-line contacts and low thermal budget so that performance-driven solar cell designs can be reliably implemented in manufacturing. Mechanical properties of solar cell printed by conductive adhesives are experimentally investigated in this work and confirmed with the simulation results.

The convergence paradigm of today, which can be characterized as multi function and high effectiveness, strongly requires an integration of RF/analog function and high-speed digital function into a single IC or package. System on Package (SOP) is a promising technology for system integration in order to meet these current trends and requirements. A passive embedded substrate is one of the most critical issues to achieve small-size and high-functional devices and modules with high integration density and deign flexibility for wireless communications.

This paper will describe integration approach for passive embedded substrate for RF applications. With the several examples such as multi-band front end module and passive/active integrated modules, the advantages of the integration using passive embedded substrates will be described with some design considerations.

Control of the low-temperature sintering of nanosilver particles was attained by dispersing and stabilizing nanosilver particles into a paste form using the selected organic binder systems. As demonstrated by scanning electron microscopy (SEM) and thermogravimetric analysis (TGA), with the existing binder systems, undesirable premature coalescence of nanosilver particles was prevented and the metastable structure was retained until the binder burned out at relatively higher temperatures. Enhanced densification was achieved upon the binder burnout because at the relatively higher temperatures the densification mechanisms, e.g., grain-boundary or lattice diffusion, become more dominant. We propose that the onset of sintering, extent of densification, and final grain size can be controlled by either the size of the initial nanosilver particles or the binder systems with different burnout characteristics.

Sn–8Zn–3Bi solder paste and Sn–3.2Ag–0.5Cu solder balls were reflowed simultaneously on Cu/Ni/Au metallized ball grid array (BGA) substrates to investigate the interfacial bonding behaviors for multiple reflow cycles at two different soldering temperature of 210 and 240 °C. The different intermetallic compounds that formed at the interface after one reflow cycle were respectively the island-shaped Ag–Au-Cu-Zn (near the solder) compounds and the Ni–Sn–Cu-Zn (near the metallized pad) compounds in 210 or 240 °C soldering systems. Layered Ag–Au–Cu–Zn, Ag5Zn8, and Ag–Zn–Sn compounds were also observed within the solder near the interface after single reflow cycle. After ten reflow cycles, the Ag–Au–Cu–Zn compounds significantly decomposed, while the Ag3Sn and Ni–Sn–Cu–Zn compounds coarsened obviously.

Intermetallic compound (IMC) spalling from electroless Ni-P film was investigated with lead-free solders in terms of solder-deposition methods (electroplating, solder paste, and thin foil), P content in the Ni-P film (4.6, 9, and 13 wt% P), and solder thickness (120 versus .200 μm). The reaction of Ni-P with Sn3.5Ag paste easily led to IMC spalling after 2-min reflow at 250 °C while IMCs adhered to the Ni-P layer after 10-min reflow with electroplated Sn or Sn3.5Ag. It has been shown that not only the solder composition but also the deposition method is important for IMC spalling from the Ni-P layer. The spalling increased with P content as well as with solder volume. Ni3Sn4 intermetallics formed as a needle-shaped morphology at an early stage and changed into a chunk-shape. Needle-shaped compounds exhibited a higher propensity for spalling than chunk-shaped compounds because many channels among the needle-shaped IMCs facilitated Sn penetration. A reaction between the penetrated Sn and the Ni3P layer formed a Ni3SnP layer and Ni3Sn4 IMCs spalled off the Ni3SnP surface. Dewetting of solder from the Ni3SnP layer, however, did not occur even after spalling of most IMCs.