The external formation of integrated circuits based
on lithographic processes is not the only possible method
for manufacturing electron devices, either integrated circuits
or photovoltaic cells. Planar technology, based on external
formation, requires a certain sequence of interactions
between the structured medium and the object being formed,
in which the configuration of the region to be formed and
its position are defined by the structure of the media and their
alignment with the object. By contrast, in self-formation
the interaction between an object to be formed and its
chaotic medium is controlled by the object structure itself,
and it is this interaction that changes the object's
structure, leading to its increasing complexity. Three kinds of
self-formation can be used in manufacturing: self-formation,
based on a certain sequential interaction between an object
and chaotic media; development, which requires
only a single chaotic medium; and reproduction,
which involves a developing object generating primary objects.
All these cases represent self-formation of artificial
systems. Simpler patterns of self-formation have already
led to various patents and technologies, while more complex
ones may be applied in the future. The following article
attempts to define the necessary and sufficient conditions
for self-formation.