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Published online by Cambridge University Press: 05 July 2012
Liquid crystal polymer (LCP) has interesting characteristics that have garneredthe attention of RF and microwave circuit designers. One major difference fromtypical high-frequency materials is that LCP is a thermoplastic. WithLCP’s advent, engineers have discovered how to integrate high-performanceelectronics directly into the thermoplastic package. The reason why LCP isattractive for RF/microwave electrical design is its unique combinationof excellent electrical and mechanical properties. LCP is extremely stable inthe presence of moisture and exhibits near-hermetic properties. Given itsrelatively low cost, LCP is rapidly becoming the material of choice for newgenerations of electronics requiring increasing integration and performance.This makes LCP a serious candidate for multi-chip module (MCM),system-in-package (SiP), and advanced packaging technology.
In section 2.1, we will first discuss LCP’s chemical properties. The basicchemistry will be introduced, and LCP’s composition will be described anddiscussed. This section is presented from an application stance and is intendedto provide a brief working background to why LCP behaves as it does.
In section 2.2 we describe LCP’s electrical properties. LCP has beencharacterized as having a very low dielectric constant and loss factor over thefrequency range from below 1 GHz up to past 110 GHz [2]. Its low dielectricconstant allows reasonable line impedances to be formed on thin-film materialand, further, minimizes the impact on the nearby electronics as well as thecapacitive detuning effects of packaging. Methods for electricalcharacterization and study results are presented. The test results of LCP inmoisture are also provided, to demonstrate its stable electrical characteristicsover humidity changes.
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