Book contents
- Frontmatter
- Contents
- Preface
- 1 Introduction to electronic package engineering
- 2 Characteristics of liquid crystal polymer (LCP)
- 3 Fabrication techniques for processing LCP
- 4 LCP for wafer-level chip-scale MEMS
- 5 LCP for surface mount interconnects, packages, and modules
- 6 LCP for passive components
- 7 LCP for system design
- 8 LCP reliability
- Abbreviations, acronyms, and symbols
- Index
Index
Published online by Cambridge University Press: 05 July 2012
- Frontmatter
- Contents
- Preface
- 1 Introduction to electronic package engineering
- 2 Characteristics of liquid crystal polymer (LCP)
- 3 Fabrication techniques for processing LCP
- 4 LCP for wafer-level chip-scale MEMS
- 5 LCP for surface mount interconnects, packages, and modules
- 6 LCP for passive components
- 7 LCP for system design
- 8 LCP reliability
- Abbreviations, acronyms, and symbols
- Index
Summary

- Type
- Chapter
- Information
- LCP for Microwave Packages and Modules , pp. 249 - 253Publisher: Cambridge University PressPrint publication year: 2012