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  3. Wireless Interface Technologies for 3D IC and Module Integration
  • Cited by 1
Publisher:
Cambridge University Press
Online publication date:
September 2021
Print publication year:
2021
Online ISBN:
9781108893299
DOI:
https://doi.org/10.1017/9781108893299
Subjects:
Engineering, Circuits and Systems, Computer Engineering
Information

Book description

Synthesising fifteen years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, practical implementation considerations, and discussion of practical applications in neural network, reconfigurable processors, and stacked SRAM. It explains the design principles and applications of two near-field wireless interface technologies for 2.5-3D IC and module integration respectively, and describes system-level performance benefits, making this an essential resource for researchers, professional engineers and graduate students performing research in next-generation wireless chip and module interface design.

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