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Effect of annealing on microstructure, residual stress, and hardness of Al–Ti multilayered films

Published online by Cambridge University Press:  31 January 2011

R. Mitra ,
A. Madan ,
R. A. Hoffman ,
W- A. Chiou  and
J. R. Weertman
R. Mitra
Affiliation:
Defence Metallurgical Research Laboratory, Kanchanbagh, Hyderabad 500 058, India
A. Madan
Affiliation:
Advanced Coating Technology Group, Northwestern University, Evanston, Illionois 60208
R. A. Hoffman
Affiliation:
Advanced Coating Technology Group, Northwestern University, Evanston, Illionois 60208
W- A. Chiou
Affiliation:
Department of Materials Science and Engineering, Northwestern University, Evanston, Illionois 60208
J. R. Weertman
Affiliation:
Department of Materials Science and Engineering, Northwestern University, Evanston, Illionois 60208

Abstract

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Al–Ti multilayered films (12 at.% Ti) with bilayer period of 16 nm were deposited by magnetron sputtering. The films were annealed in vacuum at 350 or 400 °C between 2 and 24 h. During annealing, a diffusion-controlled chemical reaction between Al and Ti layers led to Al3Ti precipitation. Differential thermal analysis studies showed an exothermic reaction associated with Al3Ti formation, taking place between 320 and 390 °C, depending on the heating rate. The evolution of microstructure with annealing was examined with transmission electron microscopy and x-ray diffraction. The hardness and residual stress of the films in the as-deposited and annealed conditions were studied in relation to the microstructural changes on annealing.

Type
Articles
Information
Journal of Materials Research , Volume 16 , Issue 7 , July 2001 , pp. 2064 - 2076
Copyright
Copyright © Materials Research Society 2001

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