Hostname: page-component-cd9895bd7-gvvz8 Total loading time: 0 Render date: 2024-12-28T00:38:10.707Z Has data issue: false hasContentIssue false
  • English
  • Français

High critical current density YBa2Cu3O7–δ coatings on LaMnO3-buffered biaxially textured Cu tapes for coated conductor applications

Published online by Cambridge University Press:  06 January 2012

T. Aytug ,
A. Goyal ,
N. Rutter ,
M. Paranthaman ,
J. R. Thompson ,
H. Y. Zhai  and
D. K. Christen
T. Aytug
Affiliation:
Oak Ridge National Laboratory, Oak Ridge, Tennessee 37831
A. Goyal
Affiliation:
Oak Ridge National Laboratory, Oak Ridge, Tennessee 37831
N. Rutter
Affiliation:
Oak Ridge National Laboratory, Oak Ridge, Tennessee 37831
M. Paranthaman
Affiliation:
Oak Ridge National Laboratory, Oak Ridge, Tennessee 37831
J. R. Thompson
Affiliation:
Oak Ridge National Laboratory, Oak Ridge, Tennessee 37831
H. Y. Zhai
Affiliation:
Oak Ridge National Laboratory, Oak Ridge, Tennessee 37831
D. K. Christen
Affiliation:
Oak Ridge National Laboratory, Oak Ridge, Tennessee 37831
Get access

Abstract

High critical current density (high-Jc) YBa2Cu3O7–δ (YBCO) films were obtained by pulsed laser ablation on biaxially textured Cu substrates. To achieve epitaxy of LaMnO3 (LMO) on Cu, thin epitaxial Ni overlayers were deposited on Cu tapes. The structure comprises the layer sequence of YBCO/LMO/Ni/Cu. For 200-nm-thick YBCO, self-field Jc values exceeding 1 × 106 A/cm2 at 77 K were achieved. Characterization of these short prototype conductors revealed good structural and morphological properties. Magnetic analysis suggested that hysteretic loss due to the ferromagnetic Ni overlayer is minimal.

Type
Articles
Information
Journal of Materials Research , Volume 18 , Issue 4 , April 2003 , pp. 872 - 877
Copyright
Copyright © Materials Research Society 2003

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

Dimos, D., Chaudari, P., Mannhart, J., and Legoues, F.K., Phys. Rev. Lett. 61, 219 (1988).CrossRefGoogle Scholar
Verebelyi, D.T., Christen, D.K., Feenstra, R., Cantoni, C., Lee, D.F., Paranthaman, M., Arendt, P.N., DePaula, R.F., Groves, J.R., and Prouteau, C., App. Phys. Lett. 76, 1755 (2000).CrossRefGoogle Scholar
Norton, D.P., Goyal, A., Budai, J.D., Christen, D.K., Kroeger, D.M., Specht, E.D., He, Q., Saffian, B., Paranthaman, M., Klabunde, C.E., Lee, D.F., Sales, B.C., and List, F.A., Science 274, 755 (1996).CrossRefGoogle Scholar
Goyal, A., Feenstra, R., List, F.A., Paranthaman, M., Lee, D.F., Kroeger, D.M., Beach, D.B., Morell, J.S., Chirayil, T.G., Verebelyi, D.T., Cui, X., Specht, E.D., Christen, D.K., and Martin, P.M., J. Met. 19 (July 1999).Google Scholar
Goyal, A., Norton, D.P., Budai, J.D., Paranthaman, M., Specht, E.D., Kroeger, D.M., Christen, D.K., He, Q., Saffian, B., List, F.A., Lee, D.F., Martin, P.M., Klabunde, C.E., Hatfield, E., and Sikka, V.K., Appl. Phys. Lett. 69, 1795 (1996).Google Scholar
Goyal, A., Specht, E.D., Kroeger, D.M., and Paranthaman, M., Methods of forming biaxially textured alloy substrates and devices thereon, U.S. Patent 5 964–966 (1999).Google Scholar
Goyal, A., Feenstra, R., Paranthaman, M., Thompson, J.R., Kang, , Cantoni, C., Le, D.F., List, F.A., Martin, P.M., Lara-Curzio, , Stevens, C., Kroeger, D.M., Kowalewski, M., Specht, E.D., Aytug, T., Sathyamurthy, S., Williams, R.K., and Ericson, R.E., Physica C 382, 251 (2002).CrossRefGoogle Scholar
Prusseit, W., Nemetschek, R., Semerad, R., Holzaphel, B., and Erickemeyer, J., in Program and Extended Abstracts of the 5th International Workshop on Superconductivity Co-Sponsored by ISTEC and MRS, Honolulu, Hawaii, 87 (2001).Google Scholar
Boffa, V., Petrisor, T., Annino, C., Fabbri, F., Bettinelli, D., Celentano, G., Ciontea, L., Gambardella, U., Grimaldi, G., Mancini, A., and Galluzi, V., Eur. Conf. Appl. Supercond. (1999).Google Scholar
Petrisor, T., Boffa, V., Celentano, G., Ciontea, L., Fabri, F., Gambardella, U., Ceresara, S., and Scardi, P., IEEE Trans. Appl. Supercond. 9, 2256 (1999).CrossRefGoogle Scholar
Boer, B. de, Reger, N., Fernandez, L.G.R., Eickemeyer, J., Berberich, P., Prusseit, W., Holzapfel, B., and Schultz, L., IEEE Trans. Appl. Supercond. 11, 3477 (2001).Google Scholar
Thieme, C.L.H., Annavarapu, S., Zhang, W., Prunier, V., Fritzemeier, L., Li, G., Schoop, U., Rupich, M.W., Gopal, M., Foltyn, S.R., and Holesinger, T., IEEE Trans. Appl. Supercond. 11, 3329 (2001).CrossRefGoogle Scholar
Watanabe, T., Ohashi, Y., Ozaki, M., Yamamoto, K., Maeda, T., Wada, K., and Hirabayashi, I., in Program and Extended Abstracts of the 5th International Workshop on Superconductivity Co-Sponsored by ISTEC and MRS, Honolulu, Hawaii, 21 (MRS, Boston, MA, 2001).Google Scholar
Yuan, G., Yang, J., and Shi, K., IEEE Trans. Appl. Supercond. 11, 3328 (2001).Google Scholar
Thompson, J.R., Goyal, A., Christen, D.K., and Kroeger, D.M., Physica C 370, 169 (2002).Google Scholar
He, Q., Christen, D.K., Budai, J.D., Specht, E.D., Lee, D.F., Goyal, A., Norton, D.P., Paranthaman, M., List, F.A., and Kroeger, D.M., Physica C 275, 155 (1997).Google Scholar
Paranthaman, M., Goyal, A., List, F.A., Specht, E.D., Lee, D.F., Martin, P.M., He, Q., Christen, D.K., Norton, D.P., Budai, J.D., and Kroeger, D.M., Physica C 275, 266 (1997).CrossRefGoogle Scholar
Aytug, T., Wu, J.Z., Cantoni, C., Verebelyi, D.T., Specht, E.D., Paranthaman, M., Norton, D.P., Christen, D.K., Ericson, R.E., and Thomas, C.L., Appl. Phys. Lett. 76, 760 (2000).Google Scholar
List, F.A., Goyal, A., Paranthaman, M., Norton, D.P., Specht, E.D., Lee, D.F., and Kroeger, D.M., Physica C 302, 87 (1998).Google Scholar
Goyal, A., Norton, D.P., Kroeger, D.M., Christen, D.K., Paranthaman, M., Specht, E.D., Budai, J.D., He, Q., Saffian, B., List, F.A., Lee, D.F., Hatfield, E., Martin, P.M., Klabunde, C.E., Mathis, J., and Park, C., J. Mater. Res. 12, 2925 (1997).CrossRefGoogle Scholar
Paranthaman, M., Lee, D.F., Feenstra, R., Goyal, A., Verebelyi, D.T., Christen, D.K., Specht, E.D., List, F.A., Martin, P.M., Kroeger, D.M., Ren, Z.F., Li, W., Wang, D.Z., Lao, J.Y., and Wang, J.H., IEEE Trans. Appl. Supercond. 9, 2268 (1999).Google Scholar
Paranthaman, M., Chirayil, T.G., List, F., Cui, X., Goyal, A., Lee, D.F., Specht, E.D., Martin, P.M., Williams, R.K., Kroeger, D.M., Morrell, J.S., Beach, D.B., Feenstra, R., and Christen, D.K., J. Am. Ceram. Soc. 84, 273 (2001).CrossRefGoogle Scholar
Aytug, T., Kang, B.W., Cantoni, C., Specht, E.D., Paranthaman, M., Goyal, A., Verebelyi, D.T., Christen, D.K., Wu, J.Z., Ericson, R.E., Thomas, C.L., Yang, C-Y., and Babcock, S.E., J. Mater. Res. 16, 2661 (2001).Google Scholar
Aytug, T., Paranthaman, M., Kang, B.W., Sathyamurthy, S., Goyal, A., and Christen, D.K., Appl. Phys. Lett. 79, 2205 (2001).Google Scholar
Sathyamurthy, S., Paranthaman, M., Aytug, T., Kang, B.W., Martin, P.M., Goyal, A., Kroeger, D.M., and Christen, D.K., J. Mater. Res. 17, 1543 (2002).CrossRefGoogle Scholar
Aytug, T., Paranthaman, M., Sathyamurthy, S., Kang, B.W., Beach, D.B., Vallet, C.E., Specht, E.D., Lee, D.F., Feenstra, R., Goyal, A., Kroeger, D.M., Leonard, K.J., Martin, P.M., and Christen, D.K., in Materials for High-Temperature Superconductor Technologies, edited by Paranthaman, M.P., Rupich, M.W., Salama, K., Mannhart, J., Hasegawa, T. (Mater. Res. Soc. Symp. Proc. 689, Warrendale, PA, 2002), p. 211.Google Scholar
London Metal Exchange, Daily Prices and Stocks, Copper Grade A and Nickel, http://www.lme.co.uk/data_prices/daily_prices.aspGoogle Scholar
Cantoni, C., Aytug, T., Verebelyi, D.T., Paranthaman, M., Specht, E.D., Norton, D.P., Christen, D.K., IEEE Trans. IEEE Trans. Appl. Supercond. 11, 3309 (2001).Google Scholar
Piñol, S., Diaz, J., Segarra, M., and Espiell, F., Supercond. Sci. Technol. 14, 11 (2001).Google Scholar
Jin, M., Han, S-C., Sung, T-H., and No, K., Physica C 334, 243 (2000).CrossRefGoogle Scholar
Rutter, N., et al. paper presented at the International Workshop on Superconductors and Applications, Gatlinburg, TN, August 1–2, 2002 (unpublished).Google Scholar
Paranthaman, M., Aytug, T., Zhai, H.Y., Sathyamurthy, S., Christen, H.M., Martin, P.M., Christen, D.K., Ericson, R.E., Thomas, C.L., in Materials for High-Temperature Superconductor Technologies, edited by Paranthaman, M.P., Rupich, M.W., Salama, K., Mannhart, J., and Hasegawa, T. (Mater. Res. Soc. Proc., 2002), p. 323.Google Scholar
Aytug, T., Paranthaman, M., Zhai, H.Y., Christen, H.M., Sathyamurthy, S., Christen, D.K, and Ericson, R.E., J. Mater. Res. 17, 2194 (2002).Google Scholar
Cantoni, C.et al., presented at the DOE Annual Peer Review meeting, Washington, DC, July 17–19, 2002 (unpublished).Google Scholar
Goyal, A., Rutter, N.A., Goyal, A., Vallet, C.E., List, F.A., Lee, D.F., Heatherly, L., and Kroeger, D.M., (unpublished).Google Scholar