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On the Shear Strength and Mixed-mode Fracture Toughness of a Lead-Tin and a Tin-Silver Solder

Published online by Cambridge University Press:  10 February 2011

M. Manoharan ,
K. S. SIOW  and
M. W. WEISER
M. Manoharan
Affiliation:
Division of Materials Engineering, School of Applied Science, Nanyang Technological University, Singapore – 639798; asmmanoharan@ntu.edu.sg
K. S. SIOW
Affiliation:
Division of Materials Engineering, School of Applied Science, Nanyang Technological University, Singapore – 639798; asmmanoharan@ntu.edu.sg
M. W. WEISER
Affiliation:
Johnson Matthey Electronics, Spokane, WA 99216
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Abstract

The increasing demands on solder joints have made it imperative that they perform not only their traditional role of electrical connection but also possess good mechanical integrity. One such key mechanical property is the shear strength of the solder. A number of specimen geometries can be used to evaluate the shear strength of solders, each with its advantages and limitations. This study uses a modified double lap shear geometry to measure the shear strength of the solders as a function of strain rate. It is ahown that the shear strength measured this way is truly reflective of the complex composite formed by the copper, solder and intermetallics and may be more representative of actual conditions of use rather than measurements of the shear strengths of the bulk solder. The study also uses a modified compact tension specimen to measure the fracture of the solder under combined tensile-shear loading conditions. It is shown that the solder fracture under these conditions follows the general principles of a mixed-mode fracture mechanism map.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 515: Symposium J – Electronic Packaging Materials Science X , 1998 , 111
Copyright
Copyright © Materials Research Society 1998

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References

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