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Recent Advances in Thin Film Multilayer Interconnect Technology for IC Packaging

Published online by Cambridge University Press:  21 February 2011

Ronald J. Jensen
Ronald J. Jensen*
Affiliation:
Honeywell Sensors and Signal Processing Laboratory, 10701 Lyndale Avenue South, Bloomington, MN 55420
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Abstract

A high-performance packaging technology being developed at Honeywell and a number of other companies uses thin-film processes to pattern high-density interconnections in multiple layers of a high-conductivity conductor (e.g., copper) and a polymer dielectric, primarily polyimide. This paper describes the physical characteristics and unique advantages of this thin film multilayer (TFML) interconnect technology; it then summarizes the results of recent work done at Honeywell in processing TFML structures, assessing the stability and reliability of the materials system, and fabricating test vehicles and demonstration packages.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 108 , 1987 , 73
Copyright
Copyright © Materials Research Society 1988

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References

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