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Stress Evolution during Thermoset Cure

Published online by Cambridge University Press:  10 February 2011

Yuhai Mei ,
Albert F. Yee ,
Alan S. Wineman  and
Chaodong Xia
Yuhai Mei
Affiliation:
Department of Mechanical Engineering and Applied Mechanics, The University of Michigan, 2250 G.G. Brown, 2350 Hayward St., Ann Arbor, MI 48109-2125
Albert F. Yee
Affiliation:
Department of Materials Science and Engineering, The University of Michigan, Ann Arbor, MI 48109-2136
Alan S. Wineman
Affiliation:
Department of Mechanical Engineering and Applied Mechanics, The University of Michigan, 2250 G.G. Brown, 2350 Hayward St., Ann Arbor, MI 48109-2125
Chaodong Xia
Affiliation:
National Starch and Chemical Company, 10 Finderne Ave., Bridgewater, NJ 08807
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Abstract

The residual stress evolution in an epoxy during isothermal curing process has been determined experimentally. It was found that for a certain curing temperature range in which the characteristic time for the molecular motions leading to volume recovery is shorter than the time scale of the experiment, an incremental elastic constitutive equation can be used to describe the mechanical response of the epoxy. It was also found that appreciable residual stresses are developed in a threedimensionally constrained epoxy resin system within the rubbery state.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 515: Symposium J – Electronic Packaging Materials Science X , 1998 , 195
Copyright
Copyright © Materials Research Society 1998

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References

REFERENCES

[1] Hohn Enns, B. and Gillham, Jhon K., “Time-Temperature-Transformation (TTT) Cure Diagram: Modeling the Cure Behavior of Thermosets,” Journal of Applied Polymer Science, Vol.28, pp.2567–2591, 1983.Google Scholar
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[5] Mei, Yuhai, Wineman, Alan S., Yee, Albert F. and Xiao, C.D.,“Pre-extended Balloon Method for Measuring the Volume Shrinkage During Thermoset Curing Process,” (The University of Michigan report), 1998.Google Scholar
[6] Mei, Yuhai, Wineman, Alan S., Yee, Albert F. and Xiao, C.D.,“Volume Shrinkage During Thermoset Curing Process,” (The University of Michigan report), 1998.Google Scholar