Hostname: page-component-745bb68f8f-f46jp Total loading time: 0 Render date: 2025-01-15T00:47:48.965Z Has data issue: false hasContentIssue false
  • English
  • Français

Thin Film Wiring for Integrated Electronic Packages

Published online by Cambridge University Press:  21 February 2011

Sheree H. Wen  and
Jungihl I. Kim
Sheree H. Wen
Affiliation:
IBM Thomas J. Watson Research Center, Yorktown Height, NY 10598
Jungihl I. Kim
Affiliation:
IBM Thomas J. Watson Research Center, Yorktown Height, NY 10598
Get access

Abstract

Among the available packaging technologies, thin film wiring is most suitable for high density package applications. This paper discusses the materials choices for the thin film wiring and some possible fabrication processes. The Cu- polymer or Cu- glass system are most promising from both performance and manufacturability perspectives. The interface adhesion and high inter layer interconnection resistance are critical problems for this structure. The use of a Cr, Cu blend structure as an interface layer will solve this problem. The microstructure, interface chemistry and the adhesion mechanisms of this blend layer are discussed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 108 , 1987 , 81
Copyright
Copyright © Materials Research Society 1988

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1.Wen, S., Advances in Electronic Materials, edited by Wessels, B.W. and Chin, G.Y.. (American Society for Metals, 1984), p. 263.Google Scholar
2.Ho, C.W., Chance, D.A., Bajorek, C.H. and Acosta, R.E., IBM Journal of R & D, 26, 286. (1982)Google Scholar
3.Bartlett, C.J., Segelken, J.M., Teneketeyer, N.A., IEEE Electronic Component Conference Proceeding 37 518. (1987)Google Scholar
4.Stanghan, C.J. and MacDonald, B.M., IEEE Trans. Components, Hybrids, and Manufacturing Technology, Vol CHMT-8, No. 4,468. (1985)Google Scholar
5.Tsunetsugu, H., Takagi, A., and Moriya, K., Int. J. Hybrid Micro- electronics, 8, 21. (1985)Google Scholar
6.Kanamori, M., Ono, H., Furutsaka, T., Matsui, J., IEEE Electron Device Letters, Vol. EDL–8, No. 5, 228. (1987)Google Scholar
7.Lane, T.A., Belcourt, F.J., and Jensen, R.J., IEEE Electronics Components Conference Proceeding, 614. (1987)Google Scholar
8.Jensen, R.J., Cummings, J.P., and Vora, H., IEEE Trans. Components, Hybrids, and Manufacturing Tech., CHMT-7, 384. (1984)Google Scholar
9.Kim, J.I., Wen, S., and Yee, D., Journal of Vacuum Science & Technology, July-August, 1988.Google Scholar