Chemical solution deposition has been used to fabricate continuous ultrathin lead lanthanum zirconate titanate (PLZT) films as thin as 20 nm. Further, multilayer capacitor structures with as many as 10 dielectric layers have been fabricated from these ultrathin PLZT films by alternating spin-coated dielectric layers with sputtered platinum electrodes. Integrating a photolithographically defined wet etch step to the fabrication process enabled the production of functional multilayer stacks with capacitance values exceeding 600 nF. Such ultrathin multilayer capacitors offer tremendous advantages for further miniaturization of integrated passive components.

Reactions of molten Sn–xCu (x = 0.05 to 1.0) alloys with Te substrate at 250 °C were investigated. A dosage of 0.1 wt% Cu in Sn is found to be effective in suppressing the vigorous Sn/Te reaction by forming a thin CuTe at the solder/Te interface. The CuTe morphology changes from irregular clusters into a layered structure with increasing Cu content in Sn. With the same reaction time, the CuTe thickness increases proportionally to the square root of Cu content in Sn–Cu alloys, suggesting a diffusion-controlled growth for CuTe.

Nanocomposite Cr–B–N coatings were deposited from CrB0.2 compound targets by reactive arc evaporation using an Ar/N2 discharge at 500 °C and −20 V substrate bias. Elastic recoil detection (ERDA), x-ray photoelectron spectroscopy (XPS), x-ray diffraction (XRD), high-resolution transmission electron microscopy (HRTEM), and selected-area electron diffraction (SAED) were used to study the effect of the N2 partial pressure on composition and microstructure of the coatings. Cross-sectional scanning electron microscopy (SEM) showed that the coating morphology changes from a glassy to a columnar structure with increasing N2 partial pressure, which coincides with the transition from an amorphous to a crystalline growth mode. The saturation of N content in the coating confirms the formation of a thermodynamically stable CrN–BN dual-phase structure at higher N2 fractions, exhibiting a maximum in hardness of approximately 29 GPa.

Indentation stress relaxation tests were carried out on high-purity polycrystalline copper specimens at room temperature with a flat cylindrical indenter. The experimental results showed that the resulting load-time relaxation curves can be described by a power law, which coupled an internal stress and an integral constant between the effective stress and relaxation time. Then the internal stress, integral constant, and dislocation velocity stress exponent can be extracted from load relaxation curves. The derived values from this way were consistent with the results of conventional uniaxial compression stress relaxation tests. These agreements are not only useful to understand deformation (dislocation) mechanisms under the indenter, but also exhibit an attractive potential of measuring nano/micromechanical properties of materials by indentation test.

Aluminum nitride was bonded with a titanium foil at 1400 °C for up to 1 h in Ar. The AlN/Ti interfacial reactions were investigated using analytical electron microscopy. Reaction layers, consisting of δ-TiN, τ2-Ti2AlN, γ-TiAl, α2-Ti3Al, a two-phase region (α2-Ti3Al + α-Ti), and α-Ti (Al, N) solid solution, were observed after annealing at 1400 °C for 0.1 h. Among these phases, the α2-Ti3Al and (α2-Ti3Al + α-Ti) were formed during cooling. Further diffusion of N atoms into the reaction zone precipitates a chopped fiber-like α2-Ti2AlN in the matrix of γ-TiAl, with [110]γ−TiAl//[11¯20]τ2−Ti2AlN and (1¯1¯1)γ−TiAl//(1¯10¯3)τ2−Ti2AlN, by substituting N atoms for one-half Al atoms after annealing at 1400 °C for 1 h. The released Al atoms, due to the precipitation of τ2-Ti2AlN, resulted in an ordered Al-rich γ-TiAl or Ti3Al5. Furthermore, the α-Ti (Al, N) was nitridized into a lamellar layer (δ-TiN + α-Ti) with [110]δ−TiN//[11¯20]α−Ti and (111)δ−TiN//(0001)α−Ti.

Frictional behavior and interfacial adhesion of differently textured pyrolytic carbon layers on Si substrate were investigated by indentation and scratch testing. A large amount of elastic recovery and a low coefficient of friction (μ = 0.05 to 0.09) were observed. Elastic/plastic and frictional behaviors of the coatings are strongly influenced by the microstructure of the pyrolytic carbon films, especially by the texture. The critical load at which the first abrupt increase in the normal displacement occurs was used to characterize interfacial adhesive strength. A pyrolytic carbon film deposited at higher residence time from a gas mixture containing 3% oxygen exhibited higher critical loads than film deposited at lower residence time without oxygen. The results can be understood if one assumes that the gas phase composition during deposition significantly influences the bonding strength at the interface. Failure mechanisms are discussed for both types of films.

The ultrastructure of nanoscale apatite biomimetically formed on an organic template from a supersaturated mineralizing solution was studied to examine the morphological and crystalline arrangement of mineral apatites. Needle-shaped apatite crystal plates with a size distribution of ∼100 to ∼1000 nm and the long axis parallel to the c axis ([002]) were randomly distributed in the mineral films. Between these randomly distributed needle-shaped apatite crystals, amorphous phases and apatite crystals (∼20–40 nm) with the normal of the grains quasi-perpendicular to the c axis were observed. These observations suggest that the apatite film is an interwoven structure of amorphous phases and apatite crystals with various orientations. The mechanisms underlying the shape of the crystalline apatite plate and aggregated apatite nodules are discussed from an energy-barrier point of view. The plate or needle-shaped apatite is favored in single-crystalline form, whereas the granular nodules are favored in the polycrystalline apatite aggregate. The similarity in shape in both single-crystalline needle-shaped apatite and polycrystalline granular apatite over a wide range of sizes is explained by the principle of similitude, in which the growth and shape are determined by the forces acting upon the surface area and the volume.

Current stressing at densities from 2.9 to 7.3 × 104 A/cm2 has significant effects on the atomic migration of eutectic SnBi solder alloys. At lower density (2.9 × 104 A/cm2), electromigration dominates the migration of both Sn and Bi, and drives Sn and Bi atoms to migrate toward the anode side. While at higher densities (4.4 and 7.3 × 104 A/cm2), the enhanced Bi electromigration induces a back stress, which promotes a reversed migration of Sn toward the cathode side. A large number of Sn atoms accumulate at the cathode side and form lumps there.

The evolution of microstructure and its influence on the mechanical properties of high-strength ultrafine eutectic Fe–(Ti, Zr)–(B, Co) alloys has been studied. The addition of B or Co improves the room temperature compressive plasticity from 1% to ∼8.5% or ∼14%, respectively, due to the formation of a heterogeneous microstructure with distinctly different length scales, which can delay the propagation of shear bands and promotes the activation of multiple shear bands.

We propose a parallel resistance model (PRM) in which total resistance (Rtotal) is given by the parallel connection of resistance of a filament (Rfila) and that of a film excluding the filament (Rexcl)—that is, 1/Rtotal = 1/Rfila + 1/Rexcl—to understand direct current (dc) electric properties of resistive random-access memory (ReRAM). To prove the validity of this model, the dependence of the resistance on temperature, R(T), and the relative standard deviation (RSD) of RHRS of Pt/NiO/Pt on the area of a top electrode, S, are investigated. It is clarified that both the R(T) and RSD depended on S, and all such dependencies can be explained by the PRM. The fact that Rtotal is decided by the magnitude relation between Rfila and Rexcl makes transport properties S-dependent and hinders the correct understanding of ReRAM. Smaller S is essential to observe the intrinsic transport properties of ReRAM filaments.

Based on the classical wetting theories, two theoretically predicted formulas of the apparent contact angles on square-pillar-array microstructured surfaces for Wenzel mode and Cassie mode have been derived, respectively. The theories of superhydrophobic stability on microstructured surfaces have been summarized. Four square-pillar-array samples were fabricated on titanium substrates by using the femtosecond laser micromachining technology, and wettability was analyzed by both experimental and analytical methods. The results showed that the titanium-based surfaces are superhydrophobic. The maximal apparent contact angle is up to 156.9°, while the corresponding sliding angle is 4.7°. Testing of the superhydrophobic stability of the surfaces showed that the maximal deviation of the apparent contact angles is only 0.6°. Analyses indicate that the stable superhydrophobicity of the supplied titanium-based surfaces is within a certain range and not perfect. To improve that, a practical controllable method is proposed herein for the design of a stable superhydrophobic surface.

With thin solid film usage expanding in numerous technologies, reliable measurements of material properties such as yield strength become important. However, for thin solid films the measurement of yield strength is not readily available, and an alternative method to obtain this property is to measure hardness and convert it to yield strength. Tabor suggested dividing hardness by ∼3 to obtain yield strength, which has been used extensively, despite its shortcomings. Since the pioneering work of Tabor, researchers have performed numerical and experimental studies to investigate the relationships between hardness, yield strength, and elastic modulus, using the indentation technique. In this study, finite element analysis was performed to simulate the nanoscratch technique. Specifically, the nanoscratch finite element analysis was used to validate a previously developed analytical scratch hardness model. A full-factorial design-of-experiments was performed to determine the significant variables for the ratio of calculated scratch hardness to yield strength and a simple analytical prediction model for the ratio of hardness to yield strength was proposed.

The present study investigated the micro-impact fracture behavior of various lead-free solder joints, including Sn–1Ag–0.1Cu–0.02Ni–0.05In, Sn–1.2Ag–0.5Cu–0.05Ni, and Sn–1Ag–0.5Cu. The fracture that occurs within the solder joint corresponds to a higher impact fracture energy (1.35 mJ), while the fracture at the interface between the solder joint and intermetallic compound acquires a smaller impact energy (0.82 mJ). Two types of fracture mechanisms were proposed based on observations of the fracture morphology and the impact curve for the solder ball joints. The longer deflection distance, referring to better elongation, exists for the mechanism corresponding to the higher fracture energy.

The elastic deformation contribution can significantly affect the measurement of the strain-rate sensitivity (SRS) of the plastic flow stress by indentation methods. In this paper, the effect of such elastic contribution is critically analyzed using an extension of a previous treatment developed by the authors for the elastic effects on the indentation of strain-hardening materials [J. Alkorta et al., J. Mater. Res.20, 432 (2005)]. The analytical model is calibrated and validated through finite element calculations. The results show that when the elastic contribution to the total deformation is not negligible then the measured SRS is significantly lower than the real one. A satisfactory correction factor for the apparent SRS exponent is proposed based on parameters directly accessible to instrumented indentation test results.

The long-duration oxidation behavior of a pressureless liquid-phase-sintered (LPS) α-SiC with 10 vol% Y3Al5O12 additives was studied by furnace oxidation tests in ambient air at 1100 to 1450 °C. The oxidation of this LPS SiC ceramic was found to be passive throughout these temperatures due to the formation of oxide scales, with a change in the oxidation behavior occurring at 1350 °C. It was also found that the oxidation behavior is very complex, exhibiting two distinct stages at all temperatures: (i) initial nonparabolic oxidation, where the rate-limiting mechanism is the outward diffusion of Y3+ and Al3+ cations from the secondary intergranular phase into the oxide scale with the activation energy of the oxidation being 504 ± 32 kJ/mol, followed by (ii) parabolic oxidation below 1350 °C, where the rate-determining mechanism is the inward diffusion of oxygen through the oxide scale with the activation energy being 310 ± 47 kJ/mol, or paralinear oxidation at and above 1350 °C, where oxidation is controlled by some mixed reaction/diffusion process. The existence of two oxidation regimes reflects the progressive crystallization of the oxide scale during the oxidation. Finally, guidelines are provided for the design and fabrication of low-cost, highly oxidation-resistant LPS SiC or other LPS nonoxide ceramics.

The relationship between the preparation conditions of MgB2 powder and the performance of the critical current density (Jc) of an applied magnetic field (B) of the final ex situ tape produced from it was investigated. The pelletizing pressure of the precursor is crucially important for improving the Jc-B performance of ex situ tape. The higher the pressure, the greater the resulting Jc of the ex situ MgB2 tape. We have shown that the pelletizing pressure used for the precursor mixture during the powder preparation process affects the phases formed in the MgB2. On the other hand, the heating time used is effective in changing the slope of the Jc-B curve of the final tape. This is thought to be due to a change in the crystallinity of the prepared MgB2 powder. The experimental data gathered here will become the basis for investigating the establishment of a guideline for preparing the starting powder used for the manufacture of ex situ MgB2 tape.

We present an off-lattice, on-the-fly kinetic Monte Carlo (KMC) model for simulating stress-assisted diffusion and trapping of hydrogen by crystalline defects in iron. Given an embedded atom (EAM) potential as input, energy barriers for diffusion are ascertained on the fly from the local environments of H atoms. To reduce computational cost, on-the-fly calculations are supplemented with precomputed strain-dependent energy barriers in defect-free parts of the crystal. These precomputed barriers, obtained with high-accuracy density functional theory calculations, are used to ascertain the veracity of the EAM barriers and correct them when necessary. Examples of bulk diffusion in crystals containing a screw dipole and vacancies are presented. Effective diffusivities obtained from KMC simulations are found to be in good agreement with theory. Our model provides an avenue for simulating the interaction of hydrogen with cracks, dislocations, grain boundaries, and other lattice defects, over extended time scales, albeit at atomistic length scales.

A finite element analysis was used to determine how patterned, nanoscale interfacial roughness could potentially increase the apparent interfacial toughness of brittle, thin-film material systems. The pattern analyzed was composed of parallel channels with either a rectangular-toothed or a rippled cross-section. Results are presented for a thin, linear elastic, bimaterial strip loaded by displacing the top edge relative to the bottom edge. The finite element calculations indicate that the interface does not unzip in a steady, continuous manner. Instead, the crack tip stalls as it tries to kink in a direction that is offset from its original path. The apparent interfacial toughness is found to depend on the intrinsic interfacial toughness, the ratio of real-to-nominal interfacial area, the extent of ligament, tooth-tip damage that occurs before crack propagation, strain energy locked in by persistent contact, and the level of energy dissipation associated with dynamic fracture.

Li2M(WO4)2 (M = Co and Ni) were synthesized by a conventional solid-state reaction method and characterized by powder x-ray diffraction, Brunauer-Emmet-Teller (BET) measurement, ultraviolet-visible (UV-vis) diffuse reflectance spectra, Raman spectroscopy, and photocatalytic evaluation measurements. Photocatalytic water splitting results showed that Li2M(WO4)2 (M = Co and Ni) exhibited abilities for H2 evolution with Pt cocatalyst from an aqueous methanol solution and for O2 evolution from an aqueous AgNO3 solution under UV light irradiation. Theoretical calculation, absorbance analysis, and photocatalytic H2 evolution experiment revealed that the position of W 5d level shifted to the negative side with respect to the reduced potential of H+/H2. The photocatalytic H2 evolution over Li2M(WO4)2 is discussed from the view of crystal and electronic structure point.

Three common Al–Au intermetallics, Al2Au, AlAu2, and AlAu4, were oxidized in the air and characterized using x-ray photoelectron spectroscopy in terms of the elemental chemical state. It was found that there is an increasing trend of oxidation in these intermetallics as the Au content increases. AlAu4 shows the greatest tendency to oxidize with two extra peaks appearing on the Au 4f spectra after long exposure time in air. The surface of AlAu2, although fully oxidized, reveals only one Au 4f peak shift as depth increases. Al2Au was the least oxidizing compound, and the oxide is thin. The binding energies of Al 2p and Au 4f peaks were measured and reported. The Au atoms trapped in the oxide layers exhibit higher binding energy emissions compared to those of elemental Au.