Microwave heating is used to activate solid phase epitaxial re-growth of amorphous silicon layers on single crystal silicon substrates. Layers of single crystal silicon were made amorphous through ion implantation with varying doses of boron or arsenic. Microwave processing occurred inside a 2.45 GHz, 1300 W cavity applicator microwave system for time-durations of 1-120 minutes. Sample temperatures were monitored using optical pyrometery. Rutherford backscattering spectrometry, and cross-sectional transmission electron microscopy were used to monitor crystalline quality in as-implanted and annealed samples. Sheet resistance readings show dopant activation occurring in both boron and arsenic implanted samples. In samples with large doses of arsenic, the defects resulting from vacancies and/or micro cluster precipitates are seen in transmission electron micrographs. Materials properties are used to explain microwave heating of silicon and demonstrate that the damage created in the implantation process serves to enhance microwave absorption.

The causes for the porosity of the microcrystalline material deposited by the expanding thermal plasma (ETP) chemical vapor deposition (CVD) technique have been investigated through IR-absorption measurements. The role of impinging ions on the structure of the material is discussed in relation to the hydrogen bounding configuration (microcrystalline factor). The ion energy is controlled through external RF biasing. Correlation between biasing and reduction of porosity is presented. The influence of high deposition pressure is as well studied, related with changes in a-Si structure.

Phase diagrams have been established to describe very high frequency (vhf) plasma-enhanced chemical vapor deposition (PECVD) processes for intrinsic hydrogenated silicon (Si:H) and silicon-germanium alloy (Si1-xGex:H) thin films using crystalline Si substrates that have been over-deposited with n-type amorphous Si:H (a-Si:H). The Si:H and Si1-xGex:H processes are applied for the top and middle i-layers of triple-junction a-Si:H-based n-i-p solar cells fabricated at University of Toledo. Identical n/i cell structures were co-deposited on textured Ag/ZnO back-reflectors in order to correlate the phase diagram and the performance of single-junction solar cells, the latter completed through over-deposition of the p-layer and top contact. This study has reaffirmed that the highest efficiencies for a-Si:H and a-Si1-xGex:H solar cells are obtained when the i-layers are prepared under maximal H2 dilution conditions.

Effects of boron doping on microcrystalline germanium carbon alloy (μc-Ge1-xCx:H) thin films have been investigated. We deposited boron-doped p-type μc-Ge1-xCx:H thin films by hot-wire chemical vapor deposition technique using hydrogen diluted monomethylgermane (MMG) and diborane (B2H6). A dark conductivity of 1.3 S/cm and carrier concentration of 1.7 x 1020 cm-3 were achieved with B2H6/MMG ratio of 0.1. Furthermore, the activation energy decreased from 0.37 to 0.037 eV with increasing B2H6/MMG ratio from 0 to 0.1. We also fabricated p-type μc-Ge1-xCx:H/n-type c-Si heterojunction diodes. The diodes showed rectifying characteristics. The typical ideality factor and rectifying ratio were 1.4 and 3.7 x 103 at ¡Ó 0.5 V, respectively.

We report the effects of intentionally introducing up to ∼ 5×1020/cm3 oxygen impurities into hydrogenated amorphous silicon-germanium alloys (of roughly 30at.% Ge) grown by the hot-wire chemical vapor deposition (HWCVD) method. Deep defect densities determined by drive-level capacitance profiling (DLCP) indicated a modest increase with increasing oxygen content (up to a factor of 3 at the highest oxygen level). Transient photocapacitance (TPC) spectra indicated a clear spectral signature for an optical transition between the valence band and an additional defect level which is attributed to oxygen impurities. The oxygen impurity related defect transition has an optical threshold around 1.4eV above the valence band and also results in a negative contribution to the TPC signal. This initially led us to believe that the bandtail for the higher oxygen samples was much narrower than it actually is. Surprisingly, this additional oxygen related defect level appears to have only a very minor effect upon the estimated minority carrier collection fraction. The effects of light-induced degradation upon some of these oxygen contaminated samples were also examined. We infer the existence of a significant thermal barrier to explain the observed spectral signatures of this oxygen impurity defect.

Hydrogen dilution of silane during the rf-PECVD growth of a-Si:H absorber layers is used to suppress light-induced degradation of a-Si:H solar cells. The increased stability of cells and films deposited using hydrogen dilution is verified in an accelerated degradation experiment. At higher hydrogen dilutions the early phase transition to the microcrystalline phase complicates the growth of fully amorphous films as absorbers with a sufficient thickness. In a systematic study on the influence of various deposition conditions on the material properties the pressure is identified as an important factor for controlling the structural phase evolution of the films.

The appearance of optically or electrically induced defects in hydrogenated amorphous silicon (a-Si:H), especially those that contribute to the Staebler-Wronski effect, has been the topic of numerous studies, yet the mechanism of defect creation and annealing is far from clarified. We have been observing the growth of defects caused by tritium decay in tritiated a Si-H instead of inducing defects optically. Tritium decays to 3He, emitting a beta particle (average energy of 5.7 keV) and an antineutrino. This reaction has a half âlife of 12.5 years. In these 7 at.% tritium-doped a-Si:H samples each beta decay will create a defect by converting a bonded tritium to an interstitial helium, leaving behind a silicon dangling bond. We use ESR (electron spin resonance) and PDS( photothermal deflection spectroscopy) to track the defects. First we annealed these samples, and then we used ESR to determine the initial defect density around 1016 to 1017 /cm3 , which is mostly a surface spin density. After that we have kept the samples in liquid nitrogen for almost two years. During the two years we have used ESR to track the defect densities of the samples. The defect density increases without saturation to a value of 3x1019/cm3 after two years, a number smaller than one would expect if each tritium decay were to create a silicon dangling bond (2x1020/cm3). This result suggests that there might be either an annealing process that remains at liquid nitrogen temperature, or tritium decay in clustered phase not producing a dangling bond due to bond reconstruction and emission of the hydrogen previously paired to Si-bonded tritium atom. After storage in liquid nitrogen for two years, we have annealed the samples. We have stepwise annealed one sample at temperatures up to 200°C, where all of the defects from beta decay are annealed out, and reconstructed the annealing energy distribution. The second sample, which was grown at 150°C, has been isothermally annealing at 300 K for several months. The defects remain well above their saturation value at 300 K, and the shape of decay suggests some interaction between the defects.

Highly conductive epiraxial silicon thin films, with conductivities more than 680 ¥Ø-1cm-1, were obtained using plasma enhanced chemical vapor deposition (PECVD) technique at 300¢ªC. The effect of hydrogen in growth of low temperature extrinsic Si thin films was studied using conductivity, Hall, and Raman measurements, and it was shown that epitaxial growth was possible at hydrogen dilution (HD) ratios more than 85%. The epitaxial growth of the extrinsic Si thin films at high hydrogen dilution regime was confirmed by high resolution transmission electron microscopy (HRTEM).

We report on the boron-doping dependence of the structural and electronic properties in nanocrystalline silicon (nc-Si:H) films directly deposited by plasma- enhanced chemical vapor deposition (PECVD). The crystallinity, micro-structure, and dark conductivity of the films were investigated by gradually varying the ratio of trimethylboron [B(CH3)3 or TMB] to silane (SiH4) from 0.1 to 2 %. It was found that the low level of boron doping (< 0.2 %) first compensated the nc-Si:H material which demonstrates slightly n-type properties. As the doping increased up to 0.5 %, the maximum dark conductivity (ód) of 1.11 S/cm was obtained while high crystalline fraction (Xc) of the films (over 70 %) was maintained. However, further increase in a TMB-to-SiH4 ratio reduced ód to the order of 10-7 S/cm due to a phase transition of the films from nanocrystalline to amorphous, which was indicated by Raman spectra measurements.

P-channel nc-Si:H thin film transistors (TFTs) with top gate and staggered source/drain contacts were fabricated using the developed p+ nc-Si:H layer. The fabricated TFT exhibits a threshold voltage (VTp) of -26.2 V and field effective mobility of holes (μp) of 0.24 cm2/V·s.

Hot-wire chemical vapor deposition (HWCVD) technique was used to deposit nanocrystalline silicon (nc-Si) thin film transistors (TFT) on thin polyimide sheets. Two straight tantalum filaments at 1850°C with a substrate to filament distance of 4 cm was used to deposit HWCVD nc-Si with no thermal damage to plastic sheet. Top-gate staggered TFTs were fabricated at 150°C and 250°C using a HWCVD nc-Si channel, PECVD silicon nitride gate dielectric, and microcrystalline n+ drain/source contacts. Leakage current of 3.3×10-12 A, switching current ratio of 3×106, and sub threshold swing of 0.51 V/decade were obtained for TFTs with aspect ratio of 1400 µm / 100 µm fabricated at 150°C. The highest electron field effect mobility was found to be 0.3 cm2/V.s observed for TFTs deposited at lower substrate temperature. Measurements showed superior threshold voltage stability of HW nc-Si TFTs over their amorphous silicon (a-Si) counterparts.

Single grain TFTs are fabricated at a maximum temperature of 100oC for macroelectronics on a plastic substrate, as Si channels are fabricated at 100oC by combination of excimer laser crystallization and sputtering. The gate oxide is formed at 80°C by inductively coupled plasma enhanced chemical vapor deposition. These TFTs have shown a smaller threshold swing of 0.49 V/dec. and a higher field-effect mobility of 290 cm2/V·s, which can be used to directly fabricate system circuits or a high quality display on a plastic substrate.

Time-resolved cavity ringdown (τ-CRD) spectroscopy has been applied to monitor the sylil (SiH3) radicals and nano-particles in pulsed very high frequency (VHF) silane (SiH4)/hydrogen (H2) plasmas under microcrystalline silicon (μc-Si:H) deposition conditions. After the plasma ignition, a small constant cavity loss (~100 ppm) on timescales smaller than ~1 s has been observed, whereas on time scales larger than ~1 s after plasma ignition, an additional cavity loss is observed. By variation of the wavelength of the CRD laser pulse, we demonstrate that the cavity loss on time scales smaller than ~1 s reflects the SiH3 absorption. On time scales larger than ~1 s, the additional cavity loss corresponds to the loss of light due to mainly scattering at the nano-particles. Under the conditions studied, the light scattering at nano-particles can be described by Rayleigh scattering during its initial growth. After ~ 2.5 s, the cavity loss reflects the transition of the scattering mechanism from dominant Rayleigh to dominant Mie-scattering. These results are discussed in terms of nano-particles growing in time and further confirmed by additional scanning electron microscopy analyses on the nano-particles created in the plasma pulse.

A desire to monolithically integrate near infrared (NIR) detectors with silicon complementary metal oxide semiconductor (CMOS) technology has motivated many investigations of single crystal germanium on silicon (Ge/Si) diodes [1-3]. Reduction of the epitaxy thermal budget below the typical chemical vapor deposition (CVD) in-situ clean temperature (Tin-situ clean > 780°C) is also increasingly desired to reduce integration complexity. Reduced temperature growth approaches have included p+-Ge/n-Si detectors formed with low temperature poly-Ge (e-beam evaporation) or heavily dislocated single crystal germanium (molecular beam epitaxy, T ~ 450°C), which have had dark currents of ~5 mA/cm2 and responsivities of ~15 mA/W at 1310 nm, despite the large number of defects in and at the Ge/Si interface. Responsivities in these materials are however low and believed to be limited by a small diffusion length (i.e., 5-30 nm [2, 4]) due to fast electron recombination in the defect rich germanium. In this paper, we evaluate a commercially available high density plasma chemical vapor deposition (HDP-CVD) process to grow low temperature (i.e., Tin-situ & Tepitaxy < ~450°C) germanium epitaxy for a p+-Ge/p-Si/n+-Si NIR separate absorption and multiplication avalanche photodetectors (SAM-APD). This device structure is of interest both to examine ways to enhance the responsivity with internal gain as well as to examine alternatives to InGaAs-InP structures for NIR Geiger mode (GM) detection. A silicon avalanche region is highly desirable for GM to reduce after-pulsing effects, which are related to defect density that are smaller in Si than in InP [5]. Despite the high defect densities in the Ge and at the interface, the Ge-Si APDs in this work are found to have relatively low dark count rates in Geiger mode.

Our research team has used hot wire chemical vapor deposition (HWCVD) to fabricate silicon heterojunction (SHJ) solar cells on p-type FZ silicon substrates with efficiencies as high as 18.2%. The best cells are deposited on anisotropically-textured (100) silicon substrates where an etching process creates pyramidal facets with (111) crystal faces. Texturing increases Jsc through enhanced light trapping, yet our highest Voc devices are deposited on un-textured (100) substrates. One of the key factors in maximizing the efficiency of our SHJ devices is the process of optimization of the material properties of the 3 - 5 nm thick hydrogenated amorphous silicon (a-Si:H) layers used to create the junction and back contact in these cells. Such optimization is technically challenging because of the difficulty in measuring the properties of extremely thin layers. This difficulty is compounded by the fact that the properties of such amorphous layers are substrate- and thickness-dependent. In this study, we have utilized spectroscopic ellipsometry (SE) and photoconductivity decay to conclude that a-Si:H films grown on (111) substrates are substantially similar to films grown on (100) substrates. In addition, analysis of the substrate temperature dependence of surface roughness evolution reveals a substrate-independent mechanism of surface smoothening with an activation energy of 0.28 eV. Analysis of the substrate temperature dependence of surface passivation reveals a passivation mechanism with an activation energy of 0.63 eV.

This paper investigates a feasibility of using a large area image sensor with an optically addressed readout for medical X-ray diagnostic imaging. A device prototype comprises a multilayer glass/ZnO:Al/p (a-SiC:H)/i (a-Si:H)/ n (a-SiC:H)/ i(a-Si:H)/p (a-SiC:H)/ a SiNx/ITO structure coupled to a scintillator layer. Here, the p-i-n-i-p structure works in both sensing and switching modes depending on the biasing conditions. A numerical simulation is used to optimize the semiconductor layer thicknesses in order to achieve a photocurrent matching between back-to-back diodes in switching mode. The charge carrier transport within the p-i-n-i-p structure is also analyzed under different electric and optical biasing conditions. A physical model supports the results.

Conditions leading to high conductivities (up to 300 S/cm) in chlorosilane-based boron-doped microcrystalline Si:Cl:H films are investigated. It is found that the high conductivity originates primarily from the growth of highly crystalline material with a high concentration of boron. Furthermore, these films grow with relatively low chlorine and hydrogen concentrations of a few percent and, according to effusion measurements of hydrogen and implanted helium, in a relatively compact structure. At a boron doping level of 1%, admixture of 10% silane to the tetrachlorosilane results in the growth of amorphous material of low conductivity while for admixture of up to 90% of silicontetrafluoride, microcrystalline Si films with high conductivities can be grown.

The influence of the surface roughness of Ag/ZnO coated substrates on the AM1.5 J-V characteristics of microcrystalline silicon (μc-Si:H) solar cells with an i-layer made by the hot-wire chemical vapour deposition (HWCVD) technique is discussed. Cells deposited on substrates with an intermediate rms roughness show the highest efficiency. When using reverse hydrogen profiling during i-layer deposition, an efficiency of 8.5 % was reached for single junction μc-Si:H n-i-p cells, which is the highest for μc-Si:H n-i-p cells with a hot-wire i-layer.

We have fabricated a new magnetic field enhanced solid phase crystallization (FESPC) polycrystalline silicon (poly-Si) thin film transistors (TFTs), which shows the excellent electrical characteristics and superior stability compared with hydrogenated amorphous silicon (a-Si:H) TFTs. The mobility (μ) and threshold voltage (VTH) of p-type TFTs of which the channel width and length are 5 μm and 7 μm, respectively are 31.98 cm2/Vs and -6.14 V, at VDS=-0.1 V. In the FESPC TFTs, the characteristics caused by grain boundary are remarkable due to large number of grain boundaries in the channel compared with poly-Si TFTs. The VTH of the TFT which have 5 μm channel length is smaller than that of 18 μm channel length by 1.36 V, which is considerably large value. It is due to the large number of grain boundaries in the channel and the high lateral electric field. The grain boundary potential barrier height is decreased, when the large lateral electric field is applied (which is called DIGBL effect). As a result of increased mobility, the drain current is increased, and VTH can be decreased. The activation energy (Ea) is strongly depended on the drain bias and the number of grain boundaries. is decreased, caused by the large drain bias and/or smaller number of grain boundaries. This decreased Ea can be reduced VTH due to increased the drain current. VTH of p-type poly-Si TFT employing FESPC on the glass substrate is affected by channel length and VDS due to energy barrier lowering effect at the grain boundary by increased lateral electrical field.

High open-circuit voltage (Voc) silicon heterojunction (SHJ) solar cells are fabricated in double-heterojunction a-Si:H/c-Si/a-Si:H structures using low temperature (<225°C) hydrogenated amorphous silicon (a-Si:H) contacts deposited by hot-wire chemical vapor deposition (HWCVD). On p-type c-Si float-zone wafers, we used an amorphous n/i contact to the top surface and an i/p contact to the back surface to obtain a Voc of 667 mV in a 1 cm2 cell with an efficiency of 18.2%. This is the best reported p-type SHJ voltage. In our labs, it improves over the 652 mV cell obtained with a front amorphous n/i heterojunction emitter and a high-temperature alloyed Al back-surface-field contact. On n-type c-Si float-zone wafers, we used an a Si:H (p/i) front emitter and an a-Si:H (i/n) back contact to achieve a Voc of 691 mV on 1 cm2 cell. Though not as high as the 730 mV reported by Sanyo on n-wafers, this is the highest reported Voc for SHJ c-Si cells processed by the HWCVD technique. We found that effective c-Si surface cleaning and a double-heterojunction are keys to obtaining high Voc. Transmission electron microscopy reveals that high Voc cells require an abrupt interface from c-Si to a-Si:H. If the transition from the base wafer to the a-Si:H incorporates either microcrystalline or epitaxial Si at c Si interface, a low Voc will result. Lifetime measurement shows that the back-surface-recombination velocity (BSRV) can be reduced to ~15 cm/s through a-Si:H passivation. Amorphous silicon heterojunction layers on crystalline wafers thus combine low-surface recombination velocity with excellent carrier extraction.

This paper reviews the research and development of hydrogenated nanocrystalline silicon (nc-Si:H) solar cells at United Solar Ovonic LLC. We have been studying nc-Si:H solar cells since 2001 and have made significant progress. We have achieved an initial active-area cell efficiency of 15.1% using an a-Si:H/a-SiGe:H/nc-Si:H triple-junction structure, a stable active-area cell efficiency of 13.3% using an a-Si:H/nc-Si:H/nc-Si:H triple-junction structure, and a stable aperture-area (420 cm2) fully encapsulated module efficiency of 9.5% using an a-Si:H/nc-Si:H double-junction structure. Although the cell efficiencies with nc-Si:H in the middle and/or bottom cells have exceeded the corresponding efficiencies achieved using a-Si:H and a-SiGe:H, we still need to address several critical issues before using nc-Si:H in photovoltaic manufacturing plants. First, the cell efficiency needs to be improved further to show a clear advantage over the conventional a-Si:H/a-SiGe:H/a-SiGe:H triple-junction cell structure. Second, we need to increase the deposition rate further to make the nc-Si:H based technology more cost effective. Third, we need to develop a machine design to overcome the large-area uniformity issue, especially for very high frequency glow discharge deposition. Fourth, we need to qualify nc-Si:H based solar cell product, especially with respect to long term reliability. We have been addressing these critical issues, and will discuss the roadmap for manufacturing a-Si:H and nc-Si:H based solar panels using the roll-to-roll technology.