As advanced CMOS scaling with FinFETs continues beyond the 10/7nm nodes, contact resistance (Rc) remains a dominant component affecting device performance. The FinFET Source/Drain (S/D) contact area has become smaller with fin pitch scaling, resulting in drastically increased Rc. To achieve higher drive currents and fully realize the performance gain from FinFET architectural changes, it is critical to continue to reduce contact resistivity (ρc) < 1.0x10-9 Ω.cm2 for both NMOS and PMOS. In this paper, we review the recent trends for ρc reduction for advanced CMOS devices and discuss approaches that have demonstrated reduction in ρc, such as in-situ heavily doped epitaxial films for S/D, advanced ion implantation and laser anneals. The implant techniques include pre-amorphization implants (PAI), dopant boosting implants, cryogenic (-100°C) implants for damage engineering and plasma doping (PLAD) for conformal doping of high aspect ratio (HAR) contacts. With such high levels of doping from epi and implants, advanced laser anneals are key for epitaxial regrowth and formation of metastable alloys for dopant supersaturation or segregation in top layers. Millisecond laser anneal (MSA) improves dopant activation and nanosecond laser anneal (NLA) permits superactivation, and both have become key enablers for ρc reduction. This paper also reviews two alternative contact approaches: dual silicide scheme and wrap-around contact (WAC), as potential pathways to further reduce Rc for advanced CMOS nodes.

Short pulse laser irradiation has the ability to bring a material into a state of strong electronic, thermal, phase, and mechanical nonequilibrium and trigger a sequence of structural transformations leading to the generation of complex multiscale surface morphologies, unusual metastable phases, and microstructures that cannot be produced by any other means. In this article, we provide an overview of recent advancements and existing challenges in the understanding of the fundamental mechanisms of short pulse laser interaction with materials, including the material response to strong electronic excitation, ultrafast redistribution and partitioning of the deposited laser energy, the peculiarities of phase transformations occurring under conditions of strong superheating/undercooling, as well as laser-induced generation of crystal defects and modification of surface microstructure.

We review the discovery of a new phase BN (named Q-BN) which has been created by nanosecond laser melting in the super undercooled state and quenching rapidly with rates exceeding several billion degrees per second. This phase, sequel to our earlier discovery of Q-Carbon, has amorphous structure from which phase-pure c-BN is formed in the form of nanodots, microcrystals, nanoneedles, and microneedles. Large-area single c-BN are formed by providing a template for epitaxial growth during quenching of super undercooled liquid BN. Since there is a rapid crystal growth from liquid, both n- and p-type dopants can be incorporated into electrically active substitutional sites with concentrations exceeding solubility limits through the phenomenon of solute trapping. We have grown diamond on c-BN by pulsed laser deposition of carbon at 500°C without the presence of hydrogen, and created c-BN and diamond epitaxial composites. We discuss the mechanism of epitaxial c-BN and diamond growth on lattice matching c-BN template under pulsed laser evaporation of amorphous carbon. This discovery on direct conversion of h-BN into phase-pure c-BN at ambient temperatures and pressures in air, represents a seminal contribution to the field of boron nitride, which is quite complementary to our discovery of graphite to diamond conversion. We have bypassed thermodynamics with the help of kinetics and time control. This research represents a major breakthrough for c-BN and diamond based high-power electronic and photonic devices, and host of other applications related to high-speed machining, deep-sea drilling, field-emission displays and biomedical applications.

Laser and oven annealing effects on hydrogen concentration, hydrogen diffusion and material microstructure in hydrogenated amorphous silicon films deposited on crystalline silicon substrates are compared. For laser annealing, a 6 W green (532 nm) continuous wave laser with 100 µm focus diameter was applied and samples of about 1 cm2 were scanned in ambient with a line distance of 50 µm and at a speed of 1 – 100 mm/s. Hydrogen content and microstructure were measured by infrared spectroscopy, and hydrogen diffusion was investigated by secondary ion mass spectroscopy (SIMS) measurements of depth profiles of deuterium and hydrogen in layered structures of deuterated and hydrogenated material. The results show that in both annealing experiments hydrogen diffuses predominantly in form of atoms although some formation of H2 molecules cannot be excluded. By comparison of laser and oven treatment, an effective temperature describing the laser treated state can be defined. Furthermore, the temperature of the thin silicon film during laser treatment is estimated.

Substantial superheating of single-crystal Si films at and near the bottom Si/SiO2 interface was observed. This was accomplished via back-side irradiation of a (100) single-crystal Si film on a quartz substrate using an excimer-laser pulse. The spatiotemporal details of the melting transition were tracked in situ using surface-side and substrate-side transient reflectance measurements, and the one-dimensional thermal profile evolution within the solid film during the heating period was numerically computed using the experimentally extracted temporal profile of the incident beam and temperature-dependent optical and thermal parameters of the materials. A simple lower-bound estimation identifies that superheating in excess of 100 K was attained within Si along the bottom (100)-Si/SiO2 interface even at moderate beam energy densities.

We have experimentally investigated the anisotropy of Si-SiO2 interfacial energy by leveraging the mixed-phase solidification (MPS) method. By examining the microstructure evolution resulting from partial-melting-and-solidification cycles, and interpreting the changes in the surface-orientation distribution of the grains in terms of the thermodynamic model, we have identified the orientation-dependent hierarchical order of Si-SiO2 interfacial energies, σ{hkl}, as: σ{100} < σ{310} < σ{113} < σ{112} < σ{221} < σ{210}∼σ{331} < σ{111}, σ{110}.

We prepared silicon hyperdoped with sulfur by ion-implantation followed by pulsed laser melting. Effects of laser fluence during pulsed laser melting and of post-annealing on the silicon hyperdoped with sulfur are investigated. The structure of hyperdoped layer changes from poly-to mono-crystal with increasing laser fluence. Interface between sulfur-implanted-layer and single-crystal substrate disappear above 1.1 J/cm2. The spectral intensity of mid-infrared (MIR) optical absorption increases with crystallinity and spectral shape depends on whether the melt depth during pulsed laser melting reaches interface between implanted layer and single-crystal silicon substrate or not. The MIR absorption intensity rapidly decreases with thermal annealing temperature and almost disappears at 750 °C. The activation energy of conductivity decreases with increasing laser fluence and further decreases with increasing post thermal-annealing temperature. The insulator-metal transition is observed for the sample annealed at 750 °C. These results indicate that there is no direct correlation between MIR optical absorption band and insulator-metal transition.

In this paper we report on the 532 nm Nd:YAG laser-induced crystallization of 10 nm thick boron-doped hydrogenated amorphous silicon thin films deposited on flexible polyimide and on rigid oxidized silicon wafers by hot-wire or by plasma-enhanced chemical vapor deposition. The dark conductivity increased from ∼10-7 Ω-1cm-1, in the as-deposited films, to ∼10 and 50 Ω-1cm-1 after laser irradiation, on rigid and flexible substrates, respectively. Depending on type of substrate, laser power and fluence, a Raman crystalline fraction between 55 and 90 % was measured in HWCVD films, which was higher than observed in rf-PECVD films (35-55 %). Crystallite size remained small in all cases, in the range 6-8 nm. Due to a very high conductivity contrast (>7 orders of magnitude) between amorphous and crystallized regions, it was possible to define conductive paths in the a-Si:H matrix, by mounting the sample on a X-Y software-controlled movable stage under the laser beam, with no need for the usual lithography steps. The resistors scribed by direct laser writing had piezoresistive properties, with positive gauge factor ∼1. The details of the laser interaction process with the Si film were revealed by scanning electron microscopy imaging.

The use of a laser annealing and chemical texturing process (dubbed the LaText process) on room-temperature sputtered ZnO:Al has been shown to generate unusually high haze properties, favorable for thin film silicon solar cells.This is due to the melting of the ZnO:Al layer by the XeCl laser, and the formation of crystalline domains onthe surface, for which the grains and grain boundaries are subsequently etched at different rates. The unusual surface morphology produced through this process can strongly impact the nature of the amorphous or microcrystalline silicon material deposited thereupon. In this paper, we report on results for amorphous silicon devices, for which the surface texture is seen to slightly impact thelight absorption in the material, but more interestingly, also the light-induced degradation of the cells.For co-deposited cells, devices deposited on surfaces with the characteristic "LaText" morphologyundergo a much lesser degradation. Furthermore, the decreased degree of degradation coincides with a notable shift in the Raman scattering peak. This provides a rapid diagnostic for testing multiple textures and deposition parameters.

In this study we analyze the electrical behavior of a junction formed by an ultraheavily Ti implanted Si layer processed by a Pulsed Laser Melting (PLM) and the non implanted Si substrate. This electrical behavior exhibits an electrical decoupling effect in this bilayer that we have associated to an Intermediate Band (IB) formation in the Ti supersaturated Si layer. Time-of-flight secondary ion mass spectrometry (ToF-SIMS) measurements show a Ti depth profile with concentrations well above the theoretical limit required to the IB formation. Sheet resistance and Hall mobility measurements in the van der Pauw configuration of these bilayers exhibit a clear dependence with the different measurement currents introduced (1µA-1mA). We find that the electrical transport properties measured present an electrical decoupling effect in the bilayer as function of the temperature. The dependence of this effect with the injected current could be explained in terms of an additional current flow in the junction from the substrate to the IB layer and in terms of the voltage dependence in the junction with the measurement current.

This work investigates scanning laser annealing used for ultra-shallow junction (USJ) activation. We investigate the laser system via simulation to determine the peak temperature achieved in the active area during processing. We employed the Sentaurus TCAD software by Synopsys to perform a 2D simulation of a laser scans across the active area of the device, solving the heat equation in both time and space. An absorber layer is deposited on the wafer surface to enhance the absorption of incident energy and reduce SOI reflectivity. An effective absorption coefficient of α=8000cm-1 was calculated for the absorber layer, calibrated with the experimental laser intensity. This absorption coefficient correctly predicts the silicon temperature as a function of power with any arbitrarily defined scan speed. To investigate the role of dopant activation, an SOI wafer was implanted with arsenic 25 keV, dose 3e15 /1.5e15 cm-2 and laser annealed in areas of target temperatures ranging from 850-1300°C. The sheet resistance was measured using 4-point probe showing sheet resistance improvement with increasing laser temperature. The extracted temperature cycle from the 2D heat simulation was used as an equivalent millisecond RTA in a full 3D process simulation to study dopant distribution and activation using Sentaurus Process Kinetic Monte Carlo (KMC), considering the effect of dopants, dopant clusters, and point defects. The results of this simulation demonstrate deactivation of arsenic above 1050°C, which is inconsistent with Hall measurements that suggest increasing laser temperature will increase mobility and activation. The results are analyzed versus the expected trends and suggest future improvements needed to the KMC model or the laser temperature profiles in order to describe activation kinetics in millisecond anneals within SOI.

The effects of the pulsed green laser annealing at ambient nitrogen for two different heights-CNWs grown on silicon substrate were investigated on the crystallinity and morphology using Raman spectroscopy, SEM, TEM and XPS. For the 1μm height-CNWs, the peak intensity of D-band spectra decreased as the laser energy density increased up to 1.3Jcm-2, ID/IG ratio decreased from 2.5 to 0.7. The crystallinity of CNWs was improved by the laser irradiation. For the 1μm height-CNWs irradiated above 1.5Jcm-2, the height of CNWs decreased gradually as the laser energy density increased, it was clarified that the surfaces of CNWs were vaporized by the laser irradiation. For the 20μm height-CNWs, the peak intensity of D band spectra also decreased until the laser energy density increased up to 0.8Jcm-2, ID/IG ratio decreased from 1.6 to 0.5. From the TEM observation of CNWs irradiated at 0.8 Jcm-2, it was confirmed that the laser irradiation changed CNWs to be highly oriented crystal structure. However above 0.8Jcm-2, the crystallinity was deteriorated due to the vaporization of CNWs as the same as the 1μm height-CNWs. The pulsed green laser annealing is effective to improve the crystallinity of CNWs on optimal laser energy density for both height-CNWs, the higher laser energy densities vaporized the CNWs and changed the morphology and crystallinity of CNWs.

Scanning Tunneling Microscope (STM) was used to examine the morphologies of selfassembled InGaAs quantum dots (QDs). In order to induce the self-assembly, unlike the conventional Stranski-Krastanov (S-K) growth method, spatial thermal modulations in nanoscale were created in-situ on strained-but-flat InGaAs surfaces in a Molecular Beam Epitaxy (MBE) growth reactor by applying interferential irradiations of laser pulses (IILP). As-irradiated surfaces were examined using an attached ultra-high vacuum (UHV) STM. STM images indicate that the irradiation of 7 nano second laser pulse induces self-assembly of QDs. The average size of laser-induced QDs is smaller while their density is larger than that of QDs formed by annealing strained but flat epilayers conventionally. Furthermore, the dot density is modulated sinusoidally with a periodicity commensurate with that of the interference, which suggests that the placement of QDs can be controlled on the scale of the optical wavelength used. QD volume analysis suggests that dots grow faster laterally than vertically so that dots become flattened as they get larger.

Laser annealing experiments on commercially available phase pure tenorite (CuO) nanoparticles (NPs) were performed in air and nitrogen atmosphere to improve the structural and electronic properties, with respect to their suitability for photovoltaic applications. The particles exhibit size variations from about 30 nm to 100 nm. The influence of the thermal treatment is investigated by photoluminescence (PL) and Raman spectroscopy. Annealing of the particles in air by a laser treatment improved the material quality by defect reduction. Additional laser annealing in N2 atmosphere leads to a phase transition of the NPs from tenorite to cuprite (Cu2O). Due to the low partial oxygen pressure, the transition is initiated at about 1/3 of the maximum laser power used for the series in air, which is indicated by a drastic increase of the band edge emission from Cu2O. However, annealing with higher laser power leads to strong defect luminescence, which originates from copper and oxygen vacancies. A weak remaining tenorite band edge emission shows an incomplete phase transition.

In this paper, we present an example of a new generation of laser-crystallization approaches that can crystallize Si films for large active-matrix displays at drastically increased effective crystallization rates. The particular scheme presented in this paper is referred to as the advanced excimer-laser-annealing (AELA) method, and it can be readily configured for manufacturing large OLED TVs using various available and field-proven technical components. As in ELA, it is mostly a partial-/near-complete-melting-regime-based crystallization approach; AELA can, however, eventually achieve greater than one order of magnitude increase in the effective rate of crystallization over that of the conventional ELA technique utilizing the same laser source. We discuss in this paper how and why such a dramatic increase can be attained, and some strategical and technological benefits and options that can be entertained regarding, and as a result of the availability of, the AELA technique.

Back surface passivation is one of the major challenges in the backside illuminated sensor technology. Ion implantation followed by non-melt pulsed Laser Thermal Annealing (LTA) has been identified as a promising candidate to address this issue. In this work, a shallow B-doped layer is implanted at the backside, further activated using LTA in the non-melt regime. LTA process effectiveness in terms of crystal damage recovery as well as dopant diffusion and activation is studied through room-temperature photoluminescence, Secondary Ion Mass Spectroscopy and four-point probe sheet resistance. These studies demonstrate that non-melt LTA with multiple pulses induces high activation without visible diffusion with an effective curing of the implantation-induced crystalline defects. This is made possible thanks to a submicrosecond process timescale coupled to a reasonable number of shots as shown by thermal simulations and simple diffusion estimations.

In this paper we show that a flash lamp can be employed to induce controlled lateral solidification of a-Si thin films. Specifically, a dual xenon-arc-lamp-based system was utilized to induce location-controlled complete melting by shaping the incident beam using a contact mask. The resulting laterally solidified microstructure consisted of exceptionally long grains (~10s to ~100s of μm) that were relatively free of intragrain-defects. With further development and optimization, the approach may lead to cost-effective/high-throughput processes and systems that can capture and enhance the advantages of laser-based/melt-mediated crystallization techniques.

Zinc Oxide (ZnO), II-VI compound semiconductor, is a promising material for ultraviolet (UV) photon sensor applications due to its attractive properties such as good photoconductivity, ease processing at low temperatures and excellent radiation hardness. The rf magnetron sputtering is a suitable deposition technique due to better control over stoichiometry and deposition of uniform film. Studies have shown that the presence of surface defects in ZnO and subsequently their passivation are crucial for enhanced photo-response characteristics, and to obtain the fast response speed. Worldwide efforts are continuing to develop good quality ZnO thin films with novel design structures for realization of an efficient UV photon sensor. In the present work, UV photon sensor is fabricated using a ZnO thin films deposited by rf magnetron sputtering on the corning glass substrate. Photo-response, (Ion/Ioff) of as-grown ZnO film of thickness 100 nm is found to be 3×103 with response time of 90 ms for UV intensity of 140 μW/cm2 (λ = 365 nm). With irradiation on ZnO thin film by pulsed Nd:YAG laser (forth harmonics 266 nm), the sensitivity of the UV sensor is found to enhance. The photo-response increases after laser irradiation to 4x104 with a fast response speed of 35 ms and attributed to the change in surface states and the native defects in the ZnO thin film. Further, enhancement in the ultraviolet (UV) photo-response (8×104) of detector was observed after integrating the nano-scale islands of Sn metal on the surface of laser irradiated ZnO thin film.

Green laser crystallization of a-Ge0.85Si0.15 films deposited using Low Pressure Chemical Vapour Deposition is studied. Large grains of 8x2 μm2 size were formed using a location-controlled approach. Characterization is done using Scanning Electron Microscopy, Atomic Force Microscopy, X-Ray Photoelectron Spectroscopy and X-Ray Diffraction.

This paper reports on new experimental findings and conclusions regarding the pulsed-laser-induced melting-and-solidification behavior of PECVD a-Si films. The experimental findings reveal that, within the partial-melting regime, these a-Si films can melt and solidify in ways that are distinct from, and more complex than, those encountered in microcrystalline-cluster-rich LPCVD a-Si films. Specifically (1) spatially dispersed and temporally stochastic nucleation of crystalline solids occurring relatively effectively at the moving liquid-amorphous interface, (2) very defective crystal growth that leads to the formation of fine-grained Si proceeding, at least initially after the nucleation, at a sufficiently rapidly moving crystal solidification front, and (3) the propensity for local preferential remelting of the defective regions and grain boundaries (while the beam is still on) are identified as being some of the fundamental factors that can participate and affect how these PECVD films melt and solidify.