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Thermal stability of sputtered copper films containing dilute insoluble tungsten: Thermal annealing study
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- 31 January 2011, pp. 1429-1434
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Formation and mechanical properties of Cu–Hf–Al bulk glassy alloys with a large supercooled liquid region of over 90 K
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- 31 January 2011, pp. 1435-1440
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Adhesion, passivation, and resistivity of a Ag(Mg) gate electrode for an amorphous silicon thin-film transistor
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- 31 January 2011, pp. 1441-1446
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Tribological properties of a B2-type Al-Pd-Mn quasicrystal approximant
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- 31 January 2011, pp. 1447-1456
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Synthesis of rutile titania powders: Agglomeration, dissolution, and reprecipitation phenomena
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- 31 January 2011, pp. 1457-1464
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Relationship between nanohardness and microstructures in high-purity Fe–C as-quenched and quench-tempered martensite
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- 31 January 2011, pp. 1465-1470
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Development of laboratory x-ray fluorescence holography equipment
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- 31 January 2011, pp. 1471-1473
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Residual strain field in indented GaAs
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- 31 January 2011, pp. 1474-1480
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Modeling of effects of adhesive interlayers on contact-induced radial cracking in brittle coatings on substrates
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- 31 January 2011, pp. 1481-1486
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Mechanical properties of Fe-based bulk glassy alloys in Fe–B–Si–Nb and Fe–Ga–P–C–B–Si systems
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- 31 January 2011, pp. 1487-1492
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