We have developed a versatile instrument for in situ measurement of motions of MEMS. Images of MEMS are magnified with an optical microscope and projected onto a CCD camera. Stroboscopic illumination is used to obtain stop-action images of the moving structures. Stopaction images from multiple focal planes provide information about 3D structure and 3D motion. Image analysis algorithms determine motions of all visible structures with nanometer accuracy.

Hardware for the system includes the microscope, CCD camera and associated frame grabber, piezoelectric focusing element, and a modular stimulator that generates arbitrary periodic waveforms and synchronized stroboscopic illumination. These elements are controlled from a Pentium-based computer using a graphical user interface that guides the user through both data collection and data analysis. The system can measure motions at frequencies as high as 5 MHz with nanometer resolution, i.e., well below the wavelength of light.

We have developed an optoelectronic laser interferometry microscope (OLIM) methodology for rapid characterization of MEMS' motion dynamics. In this study, electrostatic comb drive actuated microengines comprised of a 64 μm diameter drive gear and a 300 μm output gear (load gear) were characterized dynamically. Two different input signals were used: 1) a four-step square wave input and 2) an optimized input signal calculated from an analytical model. Out-ofplane motion on rotating microgears was measured as a function of the input signals. The outof-plane motions for the drive during the four-step input ranged from zero to ±462 nm and from zero to ±514 nm for the drive and output gears, respectively. For the optimum input, the out-ofplane motions ranged from zero to ±1030 nm for the drive gear. However, for the output gear the tilt magnitudes were nearly constant at ±514 rum, and were independent of angular position. The more constant out-of-plane motions of the load gear for the optimized signal are due to improved kinematics and kinetics leading to more continuous rather than impulsive forces (e. g., frictional, inertial) acting on the output gear.

Low temperature, wafer-level bonding offers several advantages in MEMS packaging, such as device protection during aggressive processing/handling and the possibility of vacuum sealing. Although thermocompression bonding can be achieved with a variety of metals, gold is often preferred because of its acceptance in die bonding [1] and its resistance to oxidation. This study demonstrates that the simultaneous application of moderate pressure (0.5 MPa) and temperature (300°C) produces strong wafer-level bonds. A four-point benddelamination technique was utilized to quantify bond toughness. Test specimens exhibited constant load versus displacement behavior during steady state crack propagation. Two distinct fracture modes were observed: cohesive failure within the Au and adhesive failure at the Ti-Si interface. The strain energy release rate for Au-Au fracture was found to be higher than that associated with Ti-Si fracture, consistent with the greater plastic deformation that occurs in the metal during fracture.

Many applications of MEM sensors require hermetic or high vacuum packaging of sensor clusters. For example, multiple gyroscopes or accelerometers are fabricated on a single chip to improve alignment and stability of input axes or increase the dynamic range of instruments. Chemical sensors are fabricated as large arrays to both improve selectivity and increase the number of species that can be detected. Still larger arrays of sensors must be packaged for hydrophone and bolometer imaging devices. All of these applications place a demanding combination of requirements on the sensor package. The electrical outputs of the sensor array must be well isolated from each other as well as power and excitation signals, while parasitic capacitance is minimized. The package must also be capable of being evacuated and sealed to achieve a pressure of 5 millitorr with a leakage rate below 10−11 [Std cc sec−l]. Finally, the package must be compact and low cost to realize these same attributes of the MEM sensor. This paper describes a packaging approach that is based on low temperature cofired ceramic materials. This technology meets the packaging requirements of sensor arrays and is well suited to the research environment in which the sensor design is continually evolving.

A reliable, fluxless microjoining technique based on isothermal solidification is reported. The Au-In-Ni system has been chosen for bonding, because gold is often applied for wafer bumping, and Ni is commonly used for substrate plating. To demonstrate the potential of this microjoining scheme, optical filter have been directly attached to a smart CMOS thermoelectric IR system. Since further packaging of the microsystem includes SMT assembly, the bond has to withstand subsequent SnPb reflow-soldering.

The influence of bonding time and temperature on the bond was investigated. Phase formation and transformation were analyzed by light and scanning electron microscopy (SEM). Bonding performed at temperatures below 200°C remained stable even after multiple soldering cycles with peak temperatures of 235°C. The shear strength of the bonds was found to be more than 70 MPa. Long term stability was confirmed by extended anneal at 160°C. The method is generally well suited for processes involving sequences of joining steps, and for bonds demanding high strength and high thermal stability at low bonding temperature.

Results from initial efforts to develop a quantitative understanding of the material microstructure – elastic properties relationship for electroplated LIGA nickel will be presented. Microsample tensile testing and microstructural characterization results including grain size and grain orientation measurements obtained using orientation imaging microscopy (OIM) are discussed. The use of these data in the development of a finite element modeling approach to represent the mechanical response of “meso-scale” LIGA nickel MEMS material will be highlighted.

Microstructure – mechanical property relations of 200 μm thick LIGA deposited Ni films have been investigated with a combination of optical cross-sectional microscopy and microsample tensile testing. Measurements of the grain size and morphology of nine different asdeposited films evidenced a predominantly columnar microstructure with significant variations in grain size. These as-deposited microstructural variations resulted in a range of Young's modulus, yield strength, and ultimate tensile strength values that are consistent with previously reported measurements, but these values did not appear to scale with the as-deposited microstructures. By contrast, significant changes in both the microstructure and mechanical properties were observed when these films were annealed at 800'C for 1 hour. Recrystallization and grain growth transformed the grain morphology from columnar to equiaxed, which resulted in a dramatic decrease in the tensile strength and corresponding increase in the ductility of the annealed films.

A torsional micromirror was designed and fabricated using a three-level, polysilicon, surface micromachined, microelectromechanical systems (MEMS) process. The torsional micromirrors have highly-reflective, gold-coated polysilicon optical surfaces. Electrostatically induced in-plane and outof-plane vertical deflections on the order of 2.75 νm were achieved. The modeling phase focused on the microdynamical behavior of the torsional micromirror. The IntelliCAD® finite element analysis program was used to generate a plot of the micromirror's deflection (d) versus applied direct current voltage (V). The data was least-squares fitted to the well-established V μ d3/2 relationship. A resonant frequency analysis predicted an approximate switching speed of 6 νsec. The relative reliability (number of operational cycles) of the torsional micromirror design was measured to exceed 2 million flexure events. The potential for using torsional micromirrors as binary optical switches and amplitude modulators is addressed.

A miniaturized, polysilicon version of a xylophone bar magnetometer (with dimensions on the order of microns) has been fabricated by microelectromechanical systems (MEMS) processing techniques. All devices tested to date have performed extremely well in static magnetic fields and exhibit mechanical quality factors, Q, of up to 30,000 at reduced pressures. The resonance frequency of the fundamental flexural mode of vibration of these polysilicon xylophone bars has been found to be a sensitive function of the torsional stiffness of the support arms, in quantitative accord with an analytical model based on Bernoulli-Euler beam theory.

We report the results of an optical interferometric study, which was designed to measure the magnetic-field induced displacement of a resonating xylophone bar MEMS magnetometer. The MEMS magnetometer is a Lorentz-force sensor, which transduces an alternating current and an orthogonal directed magnetic field into an alternating displacement of the xylophone bar. The Michelson interferometer system includes optics and electronics for active stabilization of the optical path length difference between the reference and sample beams. The active stabilization results in the ability to control or detect pathlength differences as small as ∼ 0.6 ×10−3 Å. With this level of operational sensitivity, the presence of a one nano Tesla magnetic field was found to produce a detectable bar displacement on the order of ∼10−3 Å. In addition to the high sensitivity, the interferometer photodetector displayed linear behavior over six decades of optical path length differences, which corresponded to a magnetic field dynamic range that spanned nano- to milli-Tesla amplitudes.

Theoretical and experimental investigations have been made to study the nonlinear static and dynamic behavior of composite Si02-Au microbridges. Measurements of maximal deflection amplitude were carried out on arrays of clamped-clamped SiO2-Au beams buckling under the effect of thin film effective residual stress. The static analysis adresses the issue of microfabricated beam buckling from an energy point of view. SiO2-Au and Au effective residual stresses are evaluated by considering the measured buckling maximal deflection and by through an adequate approximation of the shape of the microbeam deflection curve. The dynamic approach is based on a direct analytical model yielding an exact solution to the linear problem associated with the nonlinear vibrations of initially buckled clamped-clamped structures. Several experimental multi-mode dynamic responses of composite buckled beams are also given to illustrate the validity and accuracy of this analytical model.

Mechanical properties of electroplated gold microstructures were determined by measuring resonance frequencies of microbeams. Cantilever and bridge beam structures of different lengths were fabricated by electroplating surface micromachining technique, specially designed to realize an ideal fixed-boundary anchor. Fabricated beams were electrostatically excited and their resonance frequencies were measured by optical system composed of laser displacement meter with dynamic signal analyzer. Young's modulus, residual stress were calculated from the measured frequency data.

Microelectromechanical systems (MEMS) have potential application in high temperature environments such as in thermal processing of microelectronics. The MEMS designs require an accurate knowledge of the temperature dependent thermomechanical properties of the materials. Techniques used at room temperature often cannot be used for high-temperature property measurements. MEMS test structures have been developed in conjunction with a novel imaging apparatus designed to measure either the modulus of elasticity or thermal expansion coefficient of thin films at high temperatures. The MEMS test structure is the common bi-layered cantilever beam which undergoes thermally induced deflection at high temperatures. An individual cantilever beam on the order of 100 νm long can be viewed up to approximately 800°C. With image analysis, the curvature of the beam can be determined; and then the difference in coefficient of thermal expansion between the two layers can be determined using numerical modeling. The results of studying silicon nitride films on silicon oxide are presented for a range of temperatures.

A new type of fatigue testing machine for micro-sized specimens for MEMS applications has been developed. This fatigue testing machine consists of a magnetostrictive actuator which is able to impart small displacements to a specimen upto 20 νm with resolution of 5 nm. The actuator is connected to a metal shaft and a diamond tip of 5 νm in radius is attached to the end of the shaft. Small displacements are applied to the specimen through the diamond tip. This makes it possible to construct a high stiffness loading fixture. The magnitude of load applied to the specimen is measured by a strain gauge type load cell with a load resolution of 10 νN. The specimen stage and load cell can be moved to adjust the loading position precisely by a stepping motor at a translation resolution of 0.1 νm. Cantilever beam type specimens with dimensions of 10 × 12 × 50 νm3 were prepared from a Ni-P amorphous thin film by focused ion beam machining. Very small cyclic load (ΔP = 0.1 - 40 mN) was able to be applied to the specimen successfully. This machine appears to be promising for evaluation of fatigue properties for micro-sized specimens for MEMS applications.

Fatigue crack propagation tests at different stress ratios of 0.1 and 0.5 have been performed on microsized Ni-P amorphous alloy specimens to investigate the influence of stress ratio in the crack growth properties of microsized materials. The specimens tested were cantileverbeam-type with dimensions of 10 × 12 × 50 νm3 prepared by focused ion beam machining. Notches with a depth of 3 [m were introduced in all specimens. The entire set of fatigue tests as performed using a newly developed fatigue testing machine in air at room temperature. Fine stripes deduced to be striations were observed on the fatigue fracture surface. Careful measurements of the striation spacings were made. Fatigue crack propagation rate, that is striation spacing, is plotted as a function stress intensity factor range. Fatigue crack propagation rate at stress-ratios of 0.1 and 0.5 in microsized Ni-P amorphous alloy specimens are given by da/dN ∼ 1.3 × 10−8 ΔK;1.16 and da/dN ∼ 3.7 × 10−8 ΔK0.5, respectively. At a given ΔK, crack propagation rate at a stress ratio of 0.5 was higher than that at 0.1. It is considered that a decrease in crack propagation rate at stress ratio of 0.1 is due to adecrease in effective stress intensity factor range ΔKeff, by the effect of crack closure.

Characterization of the flow properties in microfluidic channels is important for designing and building biomedical microdevices, many of which depend on precise fluid flow for their operation. Similarly, in complex fluidic systems, it is important to identify flaws in processing which will potentially restrict, or short circuit the flow of the device. We explore the characterization of flow in plastic microfluidic systems through various test devices..

The understanding of the physical, chemical and mechanical properties of materials used in micro-electromechanical systems (MEMS) is essential for the successful application. For the characterization of such materials, it is often necessary to utilize a probe which can gather information on the same scale as the devices themselves. Based on these needs, x-ray microprobe analysis has been employed to perform spatially resolved measurements on several problems related to the fabrication of MEMS devices. These include spatially resolved transmission measurements of the homogeneity of transmitted flux through a graphite mask, micro-fluorescence measurements to assess elemental distributions, and micro-XANES measurements to follow the breakdown of new sulfone-based x-ray resists. These studies demonstrate the value of such an instrument in the characterization of micro-systems.

A thin film bulk acoustic wave resonator (TBAR) has been fabricated using a ZnO thin film on a SiO2 diaphragm by MEMs techniques. The ZnO/SiO2 structure TBAR can be designed to cancel a temperature coefficient of frequency (TCF) by the ZnO/SiO2 thickness ratio, because the TCF of ZnO is negative, and that of SiO2 is positive. The ZnO thin film on the SiO2 shows a c-axis orientation almost equivalent to that of the ZnO thin film on a glass substrate by RF sputtering. However, the crystallinity of the ZnO thin film is influenced by the surface conditions of substrates. ZnO thin films have been deposited on Au/Cr, Au/NiCr and Au/Ti. The Au/Ti/ZnO/Au/Ti/SiO2 structure TBAR shows the best resonant characteristics in this experiment. The resonant characteristics of the TBAR depend on the crystallinity of the ZnO thin film. The resonant resistance of the TBAR at 205MHz using a Au/Ti under electrode is about 10% less than that using an Au/Cr electrode. The x-ray diffraction result shows that the crystallinity of ZnO is greatly influenced by the crystallinity of the lower electrode. The buffer layer between an Au electrode and substrate has an influence on both the crystallinity of the ZnO thin film and the resonant characteristics of the TBAR through the Au electrode.

Fracture behavior of micro-sized Ni-P Amorphous alloy specimens has been investigated using a newly developed mechanical testing machine. Specimens with dimensions of 10 × 12 × 50 μm were prepared by focused ion beam machining. Two types of specimens with different crack geometries were prepared. One specimen has a notch with root radius is 0.25 μtm and the other has a fatigue pre-crack. The shapes of the loaddisplacement curves are different for each type of specimen. The fracture strength of the specimens with a notch is higher than that with a fatigue pre-crack and the fracture surfaces of the specimens are also different for each type of specimen. This may be due to the difference in stress concentration at the crack (notch) tip, and indicates that even a notch with a root radius of 0.25 μm is not able to be regarded as a crack for micro-sized specimens. Therefore, the introduction of a fatigue pre-crack is essential for the evaluation of fracture toughness for such micro-sized specimens.

Porous silicon (PS) is generated by electrochemical etching in hydrofluoric acid (HF). Recently porous silicon has been applied to micromachining and micro-devices as an alternate material, this material being used as a sacrificial layer. This technology competes with conventional techniques like surface and bulk micromachining regarding its speed, simplicity and reduced costs. A wide range of microstructures and free-standing structures can be fabricated with a large freedom of design in relation to the isotropic behavior of the etching. A sacrificial layer may be realized fast over varying thickness (PS formation rate 45 μm/h compared to silicon bulk micromachining rate 20 μm/h for KOH etching).

This contribution is devoted to the materials aspects of patterning and processing: we will show how basic microstructures (trenches, polysilicon cantilevers, polysilicon free-standing membranes) may be fabricated using a very simple process based on a single photolithography. The important points are the choice of the mask, porous silicon properties as a function of its formation parameters and the choice of the solution removing the sacrificial layer. The morphology and porosity of the porous silicon layers are indeed mainly determined by the electrolyte composition and by the current density for a given substrate type. Optimized conditions (HF 15% and 80 mA/cm2) lead us to an appropriate porous silicon. Finally the applicability of this technology for various microsensors will be underlined.