Research Article
Hot Embossing Lithography: Release Layer Characterization by Chemical Force Microscopy
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- 01 February 2011, J12.2
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A Systematic Study of the Formation of Nano-Tips on Silicon Thin Films by Excimer Laser Irradiation
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- 01 February 2011, J13.6
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Development of Humidity Sensors using Layer-by-Layer nanoAssembly of Polypyrrole
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- 01 February 2011, J16.4
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Microchannel Arrays in Borophosphosilicate Glass for Photonic Device and Optical Sensor Applications
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- 01 February 2011, J16.3
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Space Charge Limited Current in Porous Silicon with traces of Nitrogen Dioxide
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- 01 February 2011, J18.30
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In-Situ Pretreatment Approach for Surface Deterioration Alleviation Amidst Thermal Desorption of Si(100)
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- 01 February 2011, J2.3
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Self Organized InAs Quantum Dots on Patterned GaAs Substrates
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- 01 February 2011, J19.4
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Micro-Molded High Q Polymer Resonators for Optical Loss Determination
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- 01 February 2011, J8.1
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Critical Process Issues in the Fabrication of a Lateral, Self-cleaning, MEMS Switch
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- 01 February 2011, J19.3
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Surface Electronic States and Electrostatic Attractive Forces between Metals or Semiconductor and Tribocharged Polymers
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- 01 February 2011, J21.1
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Diode Laser Bonding of Planar MEMS, MOEMS, & Microfluidic Devices
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- 01 February 2011, J15.6
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Investigation of Electric Characteristics of Nanoscale Composite A1B5C6 Semiconductors: Experiment and Numerical Simulation
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- 01 February 2011, J13.8
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Functionalisation of Microfluidic Channels with In Situ Grown Carbon Nanotubes
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- 01 February 2011, J18.10
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Atomic Force Microscopy Probe with Integrated Loop and Shielded Leads for Micromagnetic Sensing
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- 01 February 2011, J18.9
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Spontaneous Growth of Nickel Silicide Nanowires and Formation of Self-Assembled Nanobridges by the Metal Induced Growth Method
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- 01 February 2011, J7.2
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Quantum Sizing of Power Electronics: A Trend Towards Miniaturiation of Power Electronic Systems and Equipments
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- 01 February 2011, J18.28
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Investigating Narrow Plasmons in Nanoparticle Arrays Fabricated Using Electron Beam Lithography.
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- 01 February 2011, J16.1
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A Novel Latching Relay Fabricated Using an Oxide Molded Tungsten Process
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- 01 February 2011, J11.6
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